EPEPS 2011 - 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis, synthesis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and CAD/design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society. Authors are invited to submit papers describing new technical contributions related to the broad area of electrical performance of high-speed designs, covering:
Emerging and advanced issues,
New design techniques and innovative architectures for design and management,
Novel CAD concepts, methodologies and algorithms for modeling, simulation and optimization,
with emphasis on:
System-level, board-level and on-chip interconnects
High-speed channels, links, backplanes, serial and parallel interconnects, SerDes
Multiconductor transmission lines
Memory and DDR interfaces
Jitter and noise management
Signal and thermal integrity
Power integrity and power distribution networks (PDNs)
Electronic packages and microsystems
3D interconnects, 3D packages, TSVs and MCMs
Nano interconnects and nano structures
RF/microwave packaging structures, RFICs, mixed signal modules and wireless switches
Package-chip co-design
Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools and flows
Macromodeling including model order reduction as it applies to electrical analysis
Advanced and parallel CAD techniques for signal, power and thermal integrity analysis
Measurement and data analysis techniques for system-level and on-chip structures.