IMS 2009 - IMS 2009 IEEE International Microwave Symposium

Steering Committee
Chairman
Fred Schindler
m.schindler-AT-ieee.org
Technical Program
Mark Gouker
mark.gouker-AT-ieee.org
Lawrence Kushner
kushner-AT-ieee.org
Workshops
Gregory Lyons
g.lyons-AT-ieee.org
Short Courses
Robert Jackson
jackson-AT-ecs.umass.edu
Interactive Forum
Dan Swanson
d.swanson-AT-ieee.org
Panel/Rump Sessions
Phil Smith
pmsmith-AT-ieee.org
Focused/Special Sessions
Tim Hancock
hancockt-AT-ieee.org
Plenary Session
John Heaton
johnheaton-AT-ieee.org
Student Competition
Jim Komiak
jkomiak-AT-ieee.org
Virtual Participation
Charlotte Blair
cblair-AT-ieee.org
Publications
George Heiter
g.heiter-AT-ieee.org
Nick Kolias
n.kolias-AT-ieee.org
Operations
Luciano Boglione
l.boglione-AT-ieee.org
Finance
Bob Alongi
r.alongi-AT-ieee.org
Local Arrangements
Tom Costas
tcostas-AT-ieee.org
Exhibition Management
Lee Wood
lee-AT-mpassociates.com
The IEEE Microwave Theory and Techniques Society (MTT-S) International Microwave Symposium
2009 (IMS 2009) will be held in Boston, Massachusetts, as the centerpiece of Microwave Week
2009, scheduled from Sunday, 7 June through Friday, 12 June 2009. Technical papers describing
original work in research, development, and application of RF and microwave theory and techniques
are solicited, with typical technical areas listed below.
MICROWAVE WEEK 2009: IMS opens on Monday evening with Plenary; technical sessions
will run from Tuesday through Thursday of Microwave Week. Workshops will be held on Sunday,
Monday, Wednesday and Friday. In addition to IMS 2009, a microwave exhibition, a historical
exhibit, the RFIC Symposium (www.rfi c2009.org), and the ARFTG Conference (www.arftg.org)
will also be held in Boston during Microwave Week 2009.
PAPER SUBMISSION GUIDELINE: Technical papers for this symposium must be submitted
via the IMS 2009 website, www.ims2009.org. Complete information on how to submit a paper
and register for the conference, as well as other important information, can be found at the IMS
2009 website.
PROPOSALS INVITED: Workshop (Tutorial through Expert level), Short Course, Special
Session (Focused and Honorary), and Panel/Rump Session proposals are invited. Visit the
following links to suggest topics, or to volunteer to help organize or participate in an interactive
Workshop (www.ims2009.org/Workshops.php), Short Course (www.ims2009.org/ShortCourses.
php), Special Session (www.ims2009.org/SpecialSessions.php), or Panel Session (www.
ims2009.org/PanelSessions.php).
Proposals for workshops, short courses, panels, and special sessions: 19 September 2008
Paper Submission: 8 December 2008
Final Manuscript Submission: 20 March 2009
All submissions must be made through the IMS 2009 portal: www.ims2009.org
ALL SUBMISSIONS MUST BE MADE IN PDF FORMAT Hard copies not accepted.
The authors are responsible for formatting. Font embedding must be IEEE Xplore compatible.
Electronic Submission Deadlines
1. Field Analysis and Guided Waves
2. Frequency Domain Techniques
3. Time Domain Techniques
4. CAD Algorithms and Techniques
5. Linear Device Modeling
6. Nonlinear Device Modeling
7. Nonlinear Circuit Analysis and System Simulation
Microwave Modeling Focus
8. Transmission Line Elements
9. Passive Circuit Elements
10. Planar Passive Filters and Multiplexers
11. Non-Planar Passive Filters and Multiplexers
12. Active, Tunable and Integrated Filters
13. Ferroelectric, Ferrite and Acoustic Wave Components
14. MEMS Components and Technologies
Passive Component Focus
Call for Papers
www.ims2009.org
15. Semiconductor Devices and Monolithic IC Technologies
16. Signal Generation
17. Frequency Conversion and Control
18. HF/VHF/UHF Technologies and Applications
19. Power Amplifier Devices and Integrated Circuits
20. High-Power Amplifiers
21. Low Noise Components and Receivers
22. Millimeter Wave and Terahertz Components and
Technologies
Active Component Focus
23. Microwave Photonics
24. Signal Processing Circuits and Systems at GHz Speeds
25. Packaging, Interconnects, MCMs and Hybrid
Manufacturing
26. Instrumentation and Measurement Techniques
27. Biological Effects and Medical Applications
28. Smart Antennas, Spatial Power Combining and Phased
Arrays
29. Radars and Broadband Communication Systems
30. Wireless and Cellular Communication Systems
31. Sensors and Sensor Systems
Microwave System Focus
Paper Submission Instructions:
1. Download the paper submission template from www.
ims2009.org to view the suggested paper format.
Authors are encouraged to adhere to the format
provided in the template. The paper must be in PDF
format and the file size must be less than 1MB.
2. Submit the paper at www.ims2009.org by 8 December
2008. Late submissions will not be considered. The
system will accept up to four pages including text and
figures.
3. Authors of accepted papers will be required to submit a
final paper for publication in the Symposium CDROM.
Notice of paper acceptance and the necessary
information to electronically submit this final version of
the paper will be sent to the authors in January 2009.
Paper Selection Criteria: All submissions must be in
English. IMS 2009 Technical Program subcommittees
will review the papers. The selection criteria will
include the following factors:
Originality: How is the contribution unique, significant,
and state-of-the-art? Are references to previous work by
the authors and others included?
Quantitative content: Does the paper give an explicit
description of the work with complete supporting data?
Clarity: Is the contribution clear? Are the writing and
accompanying figures clear and understandable?
Interest to MTT-S membership: Why should this work
be reported at this conference?
Technical Areas: Author-selected technical areas (see
next page) will be used to determine the appropriate
review committees. Choose a primary and an alternative
area when you complete the author registration form.
The paper abstract should contain information that clearly
reflects the choice of area. The technical areas are categorized
in four focus areas or tracks. These focus tracks
will be used in the organization of the paper presentation
schedule at the symposium and are included here
for future reference. Note that it is permissible to choose
a primary and an alternative technical area that are in
different focus tracks. The IMS 2009 TPC may transfer
inappropriately placed papers into more appropriate
subcommittees.
Presentation Format: The International Microwave
Symposium offers three types of presentations:
1. Full-Length Papers report significant contributions, advancements,
or applications of microwave technology
in a formal presentation format with limited audience
interaction.
2. Short Papers typically report specific refinements or improvements
in the state-of-the-art in a formal presentation
format with limited audience interaction.
3. Interactive Forum Papers provide an opportunity for
authors to present theoretical or experimental results in
greater detail in a poster format, and/or to display hardware,
perform demonstrations, and conduct discussions
in an informal manner with interested colleagues.
The author¡¯s preference will be honored where possible,
but the paper will be placed in the most appropriate area
and presentation format consistent with the constraints
of the Technical Program. All presentations at IMS 2009
will be given using electronic data projection. No 35-mm
slide projectors or overhead transparency projectors will
be available.
Student Paper Competition: A Student Paper Competition
will be held as part of the Symposium. Student
papers will be reviewed in the same manner as all other
conference papers. Papers accepted for the competition
will be judged on content and presentation. First, second,
and third prizes will be awarded. To be considered for an
award, the student must have been a full-time student
(minimum 9 hours/term graduate, 12 hours/term undergraduate)
during the time the work was performed, be the
lead author, and must present the paper at the Symposium.
During the paper submission process, the student is
required to provide the e-mail address of the advisor, who
will be asked to certify that the work is primarily that of the
student. Students may also elect to have their presentations
recorded, as part of the IMS 2009 Virtual Participation
program (see: www.ims2009.org/virtualparticipation.
php). Recorded sessions will be viewable by all IMS
attendees as well as virtual participants.
Notification: Authors will be notified of the decision in
January 2009 via e-mail, using the address(es) provided
during the original paper submission. Authors of accepted
papers will be referred to the website for forms and
detailed instructions for preparing manuscripts for publication.
Final manuscripts must be received by 20 March
2009, to be published on the CD-ROM and to qualify for
presentation at the Symposium.
Clearances: It is the author¡¯s responsibility to obtain all
required company and government clearances prior to
submitting a paper. A statement certified by the submitting
author that such clearances have been obtained and
a completed IEEE copyright form must accompany the
final manuscript of each accepted paper. Details regarding
clearances will be available through the paper submission
website (www.ims2009.org).
Technical Paper Submission
Technical Areas
8. Transmission Line Elements
Planar, non-planar, and micromachined transmission lines
and waveguides, including periodic and metamaterial-type
structures, discontinuities, junctions, and transitions.
9. Passive Circuit Elements
Couplers, dividers/combiners, hybrids, resonators, lumped element approaches
to circuit design.
10. Planar Passive Filters and Multiplexers
Innovative synthesis and analysis of (non-tunable) planar filters and multiplexers.
Includes planar superconducting structures.
11. Non-Planar Passive Filters and Multiplexers
Waveguide, dielectric resonator, and non-planar superconducting structures.
12. Active, Tunable and Integrated Filters
Integrated filters (on Si, LTCC, LCP, MCM-D, GaAs, ¡?), active, tunable, and
reconfigurable filters. Filters based on metamaterials, DGS, EBG, and other
structures.
13. Ferroelectric, Ferrite and Acoustic Wave Components
Ferroelectric devices, bulk and thin film ferrite components,
surface and bulk acoustic wave devices including FBAR devices.
14. MEMS Components and Technologies
RF microelectromechanical and micromachined components
and subsystems: switches, resonators, tunable passive filters,
phase shifters, reconfigurable filters, and antennas. Modeling,
packaging, reliability, novel materials, and assembly processes
Passive Component Focus
1. Field Analysis and Guided Waves
Novel guiding structures, new physical phenomena in transmission lines
and other waveguiding structures, and new analytical methods for solving
guided-wave problems.
2. Frequency Domain Techniques
Frequency Domain methods for numerical solution of electromagnetic
problems, including field interactions with devices, circuits, and with other
physical processes.
3. Time Domain Techniques
Time Domain methods for numerical modeling of high frequency electronics,
including modeling based on physical behaviors (electromagnetic,
semiconductor, thermal, mechanical).
4. CAD Algorithms and Techniques
Circuit analysis methods, optimization methods, statistical
analysis.
5. Linear Device Modeling
Linear models of active and passive devices, models.
6. Nonlinear Device Modeling
Large Signal device models, characterization, parameter extraction, validation.
Power Amplifier modeling.
7. Nonlinear Circuit Analysis and System Simulation
Harmonic balance, simulation techniques, distortion and spurious analysis,
system simulations, and behavioral modeling.
Microwave Modeling Focus
23. Microwave Photonics
Microwave/optical interactions and device technology. Wireless over fiber, freespace
optical technology, broadband cable
applications of photonics, optical transmission effects.
24. Signal Processing Circuits and Systems at GHz Speeds
High-speed mixed-signal components, modules and subsystems; ADC, DAC,
and DDS; backplanes, signal integrity and equalization; electrical/optical
interfaces and transmission; MIMO; SDR and cognitive systems.
25. Packaging, Interconnects, MCMs and Hybrid Manufacturing
Dielectrics and substrates, component and subsystem packaging, assembly
methods, hybrid integration, interconnects
and multi-chip modules, hybrid manufacturing, yield and cost.
26. Instrumentation and Measurement Techniques
Network, Time Domain, and spectral measurements, field
mapping, error correction and estimation, materials measurements.
27. Biological Effects and Medical Applications
Biomedical applications of microwaves, applications in biology,
microwave fields and interactions in tissues.
28. Smart Antennas, Spatial Power Combining and Phased Arrays
Smart antennas for wireless applications, spatial power combining, phased
arrays, retrodirective systems, T/R modules,
multiple-beam scanning, active integrated antennas.
29. Radars and Broadband Communication Systems
Broadband and MMW communication systems for terrestrial,
vehicular, satellite, and indoor applications. Radar systems
and subsystems. UWB systems and subsystems.
30. Wireless and Cellular Communication Systems
Wireless system and transceiver architectures for 3G/4G for cellular system,
WLAN, UWB, WiMax, and Cognitive Radio Systems.
31. Sensors and Sensor Systems
RFID, IVHS, wireless microsensors, nondestructive testing,imaging, and
remote sensing.
Microwave System Focus
15. Semiconductor Devices and Monolithic IC Technologies
Multifunction and monolithic integrated components: RF, microwave, and
Millimeter Wave MMICs on GaAs, SiGe ICs, and other technologies. MMIC
manufacturing, reliability, failure analysis, yield, and cost.
16. Signal Generation
CW and pulsed oscillators, VCOs, DROs, YTOs, PLOs, and frequency
synthesizers. Applications of new devices and resonators, noise in oscillators,
DDS techniques.
17. Frequency Conversion and Control
Electronic switches, phase shifters, limiters, mixers, frequency multipliers, and
frequency dividers.
18. HF/VHF/UHF Technologies and Applications
Technology for HF, VHF, and UHF including passive and active components,
lumped and distributed elements, transmitters and receivers.
19. Power Amplifier Devices and Integrated Circuits
Design and performance (with experimental data) of discrete and IC power
amplifiers for RF, microwave, and Millimeter Wave signals, wide bandgap
devices.
20. High-Power Amplifiers
High-power amplifier design and characterization, linearization techniques,
power combining techniques, vacuum electronics.
21. Low Noise Components and Receivers
Low-noise amplifiers, detectors, devices, receivers, radiometers, models, and
characterization methods for low-noise circuits and components.
22. Millimeter Wave and Terahertz Components and Technologies
Millimeter Wave components, technologies, and applications above 30 GHz,
submillimeter wave/terahertz devices, instruments, and applications including
THz imaging.
Active Component Focus
www.ims2009.org
About Boston, Massachusetts:
Famous for everything from the Red Sox and Paul Revere to Cheers and seafood, Boston is a popular
destination. Part history lesson, part modern metropolis, the Hub offers attractions to suit everyone. It is easy
to get around, either on foot or by the user-friendly public transportation system. The Freedom Trail, one of
America¡¯s first historic walking trails, will take you through 16 historical sites that span over two and a half
centuries of America¡¯s past. Between landmarks, you can shop stores on Newbury Street, have an authentic
Italian meal in the North End or browse the antique shops and distinctive red-brick buildings of Beacon Hill. The
more culturally inclined will not want to miss the city¡¯s world-class museums, theaters and music venues. Boston
is also home to a renowned aquarium, both a children¡¯s museum and science museum, along with the Museum
of Fine Arts (MFA) and the Institute of Contemporary Art (ICA) whose groundbreaking exhibitions and engaging
programs, to state-of-the-art gallery space showcase not only outstanding art but innovative and exciting ways
for people to interact with the masterpieces. For additional information visit: www.bostonusa.com.
IEEE Microwave Theory and Techniques Society (MTT-S):
The IEEE MTT-S is a volunteer run, transnational society with more than 10,000 members and 120 chapters worldwide. Our
society promotes the advancement of microwave theory and its applications, including RF, microwave, Millimeter Wave, and
terahertz technologies.
For more than 50 years the MTT-S has worked to advance the professional standing of its members and enhance the
quality of life for all people through the development and application of microwave technology. As we enter into an exciting
future our mission is to continue to understand and influence microwave technology. The activities sponsored by the MTT-S
include a broad spectrum of conferences, workshops, tutorials, technical committees, chapter meetings, publications and
professional education programs. For additional information visit: www.mtt.org.
The IEEE MTT-S International Microwave Symposium 2009 (IMS 2009) will be held in Boston, Massachusetts, Sunday, 7
June through Friday, 12 June 2009. Technical papers describing original work in research, development, and application of
RF and microwave theory and techniques are solicited.
Proposals for workshops, short courses, panels, and special sessions: 19 September 2008
Paper Submission: 8 December 2008
Final Manuscript Submission: 20 March 2009
All submissions must be made through the IMS 2009 portal: www.ims2009.org
ALL SUBMISSIONS MUST BE MADE IN PDF FORMAT Hard copies not accepted.
The authors are responsible for formatting. Font embedding must be IEEE Xplore compatible.
Electronic Submission Deadlines