DATICS-IMECS 2009 - DATICS-IMECS 2009 Design, Analysis and Tools for Integrated Circuits and Systems
Topics/Call fo Papers
DATICS-IMECS'09
Design, Analysis and Tools for Integrated Circuits and Systems (DATICS'09)
SPECIAL SESSION IN THE IAENG IMECS CONFERENCE
The International MultiConference of Engineers and Computer Scientists 2009 (IMECS 2009) is organised by the International Association of Engineers (IAENG), a non-profit international association for the engineers and the computer scientists. IAENG IMECS 2009 will take place in Hong Kong, 18-20 March, 2009.
URL: http://www.iaeng.org/IMECS2009
AIMS AND SCOPE
Main target of the Special Session: DATICS'09 is to bring together software/hardware engineering researchers, computer scientists, practitioners and people from industry to exchange theories, ideas, techniques and experiences related to all areas of design, analysis and tools for integrated circuits (e.g. digital, analog and mixed-signal circuits) and systems (e.g. real-time, hybrid and embedded systems). DATICS'09 also focuses on the fields of formal methods, low power design methodologies for integrated circuits and wireless sensor networks (WSNs).
TOPICS
Topics of interest include, but are not limited to, the following:
digital, analog, mixed-signal and asynchronous design
processor, memory and RF design
DSP and FPGA/ASIC-based design
synthesis and physical design
ATPG, design-for-testability and built-in self test methodologies
embedded system hardware/software co-design and co-verification
CAD/EDA methodologies and tools
statistical timing analysis and low power design methodologies
network and system on-a-chip and applications
communication and wireless sensor networks (WSNs)
specification languages: SystemC, SystemVerilog and UML
theory and foundations: model checking, SAT-based methods, use of PSL, compositional methods and probabilistic methods
applications of formal methods: equivalence checking, CSP applications and transaction-level verification
verification methods based on hardware description/system-level languages (e.g. VHDL, SystemVerilog and SystemC)
industrial experience reports and case studies
real-time, hybrid and embedded systems
all areas of modelling, simulation and verification of systems
formalisms: process algebras, petri-nets, automaton theory and BDDs
software engineering (including real-time Java, real-time UML and performance metrics)
INDUSTRIAL COLLABORATORS AND SPONSORS
The special session is partnered with:
CEOL: Centre for Efficiency-Oriented Languages "Towards improved software timing", University College Cork, Ireland (http://www.ceol.ucc.ie)
International Software and Productivity Engineering Institute, USA (http://www.intspei.com)
Intelligent Support Ltd., United Kingdom (http://www.isupport-ltd.co.uk)
Minteos, Italy (http://www.minteos.com)
M.O.S.T., Italy (http://www.most.it)
Electronic Center, Italy (http://www.el-center.com)
Legalefiscale - Tax & Commercial Law Firm, Italy (http://www.legalefiscale.it)
This special session is sponsored by:
LS Industrial Systems, South Korea (formerly LG Industrial Systems) - http://eng.lsis.biz
Solari, Hong Kong (official sales agent of Sanyo LCD camera modules) - http://www.solari-hk.com
ORGANISER - CHAIRMAN
Dr. Ka Lok Man, University College Cork, Ireland
INTERNATIONAL PROGRAM COMMITTEE
Prof. Vladimir Hahanov, Kharkov National University of Radio Electronics, Ukraine
Prof. Paolo Prinetto, Politecnico di Torino, Italy
Prof. Massimo Poncino, Politecnico di Torino, Italy
Prof. Alberto Macii, Politecnico di Torino, Italy
Prof. Joongho Choi, University of Seoul, South Korea
Prof. Wei Li, Fudan University, China
Prof. Michel Schellekens, University College Cork, Ireland
Dr. Emanuel Popovici, University College Cork, Ireland
Dr. Jong-Kug Seon, System LSI Lab., LS Industrial Systems R&D Center, South Korea
Dr. Umberto Rossi, STMicroelectronics, Italy
Prof. Franco Fummi, University of Verona, Italy
Dr. Graziano Pravadelli, University of Verona, Italy
Yui Fai Lam, Manager, Mircosystems Packaging Institute, University of Science and Technology, Hong Kong
Dr. Vladimir PavLov, International Software and Productivity Engineering Institute, USA
Ajay Patel, Director, Intelligent Support Ltd, United Kingdom
Dr. Jinfeng Huang, Philips & LiteOn Digital Solutions Netherlands, Advanced Research Center, The Netherlands
Dr. Thierry Vallee, Georgia Southern University, Statesboro, Georgia, USA
Dr. Menouer Boubekeur, University College Cork, Ireland
Dr. Ana Sokolova, University of Salzburg, Austria
Dr. Sergio Almerares, STMicroelectronics, Italy
Monica Donno, Director, Minteos, Italy
Prof. Jun-Dong Cho, Sung Kyun Kwan University, South Korea
Prof. AHM Zahirul Alam, International Islamic University Malaysia, Malaysia
Prof. Gregory Provan, University College Cork, Ireland
Dr. Miroslav N. Velev, Aries Design Automation, USA
Prof. M. Nasir Uddin, Lakehead University, Canada
Dr. Alexei Botchkarev, IEEE Canada Board of Directors
Dr. Dragan Bosnacki, Eindhoven University of Technology, The Netherlands
Dr. Dave Hickey, University College Cork, Ireland
Dr. Tomas Krilavičius, Vytautas Magnus University, Lithuania
Dr. Milan Pastrnak, Siemens IT Solutions and Services, Slovakia
Dr. John Herbert, University college Cork, Ireland
Prof. Zhe-Ming Lu, Sun Yat-Sen University, China
Prof. Jeng-Shyang Pan, National Kaohsiung University of Applied Sciences, Taiwan
Prof. Chin-Chen Chang, Feng Chia University, Taiwan
Prof. Mong-Fong Horng, Shu-Te University, Taiwan
Prof. Liang Chen, University of Northern British Columbia, Canada
Prof. Chee-Peng Lim, University of South Australia, Australia
Prof. Ngo Quoc Tao, Vietnamese Academy of Science and Technology, Vietnam
Prof. Suash Deb, C. V. Raman College of Engineering, India
Dr. Salah Merniz, Mentouri University, Constantine, Algeria
Dr. Oscar Valero, University of Balearic Islands, Spain
Prof. Yang Yi, Sun Yat-Sen University, China
Dr. Damien Woods, University of Seville, Spain
Dr. Franck Vedrine, CEA, France
Prof. Bruno Monsuez, ENSTA, France
Prof. Kang Yen, Florida International University, USA
Prof. Takenobu Matsuura, Tokai University, Japan
Dr. R. Timothy Edwards, MultiGiG, Inc., USA
Dr. Olga Tveretina, Karlsruhe University, Germany
Dr. Maria Helena Fino, Universidade Nova De Lisboa, Portugal
Dr. Adrian Patrick O'Riordan, University College Cork, Ireland
Dr. Grzegorz Labiak, University of Zielona Gora, Poland
Prof. M.S. Gaur, Malaviya National Institute of Technology, Jaipur, India
Dr. Jian Chang, Texas Instruments, Inc, USA
Prof. Yeh-Ching Chung, National Tsing-Hua University, Taiwan
Dr. Anna Derezinska, Warsaw University of Technology, Poland
INTERNATIONAL REVIEWERS
Peter Westermann, Technical University of Dortmund, Germany
Tom English, University College Cork, Ireland
Miquel Moreto Planas, Technical University of Catalonia, Spain
Chelho Chung, System Semiconductor/Central R&D Center, LS Industrial Systems, South Korea
Amlan Chakrabarti, University of Calcutta, India
Chi-Un Lei, The University of Hong Kong, Hong Kong
Arkadiusz Bukowiec, University of Zielona Gora, Poland
Mohamed Bamakhrama, Eindhoven University of Technology, The Netherlands
B. Rajendra Naik, Osmania University, India
ORGANISING CHAIRS
Dr. Maria O'Keeffe, University College Cork, Ireland
Michele Mercaldi, M.O.S.T., Italy
PAPER SUBMISSIONS, PROCEEDINGS, INDEXING AND JOURNAL PUBLICATIONS
Prospective authors are invited to submit their draft paper to be limited to a maximum length of 6 page in full paper to ss.datics-AT-gmail.com by 1 December 2008.
The submitted file can be in MS Word format, PS format, or PDF formats. The first page of the draft paper should include:
Title of the paper;
Name, affiliation and e-mail address for each author;
A maximum of 5 keywords of the paper.
Please use the following MS Word Template or Tex Template.
The accepted papers in DATICS'09 be published by IAENG (ISBN: 978-988-17012-2-0) in hardcopy and will be indexed in major database indexes so that it can be assess easily. After the publication of the proceeding, print copies will be sent to databases like IET INSPEC, EBSCO, ISI Thomson Scientific, Engineering Index (EI), The Technology Research Databases (TRD) of CSA (Cambridge Scientific Abstracts), DBLP and Computer Science Bibliographies for indexing.
Expanded and enhanced versions of accepted papers in DATICS'09 can also be considered for inclusion in one of the IAENG journals, the IIUM Engineering Journal, the IBSU Scientific Journal or the IJDATICS Journal.
IMPORTANT DEADLINES
Deadline for full paper submission: 1 December 2008
Notification of acceptance: 1 January 2009
Deadline for authors' registration: 15 January 2009
Deadline for final manuscript submission: 10 February 2009
BECOMING A SPONSOR OF DATICS'09
For information, please contact ss.datics-AT-gmail.com.
TECHNICAL COMMITTEE
If you are interested in joining the DATICS International Program Committee and Reviewers, please submit a brief CV by email to ss.datics-AT-gmail.com.
ENQUIRIES
Please direct all enquiries to ss.datics-AT-gmail.com.
Design, Analysis and Tools for Integrated Circuits and Systems (DATICS'09)
SPECIAL SESSION IN THE IAENG IMECS CONFERENCE
The International MultiConference of Engineers and Computer Scientists 2009 (IMECS 2009) is organised by the International Association of Engineers (IAENG), a non-profit international association for the engineers and the computer scientists. IAENG IMECS 2009 will take place in Hong Kong, 18-20 March, 2009.
URL: http://www.iaeng.org/IMECS2009
AIMS AND SCOPE
Main target of the Special Session: DATICS'09 is to bring together software/hardware engineering researchers, computer scientists, practitioners and people from industry to exchange theories, ideas, techniques and experiences related to all areas of design, analysis and tools for integrated circuits (e.g. digital, analog and mixed-signal circuits) and systems (e.g. real-time, hybrid and embedded systems). DATICS'09 also focuses on the fields of formal methods, low power design methodologies for integrated circuits and wireless sensor networks (WSNs).
TOPICS
Topics of interest include, but are not limited to, the following:
digital, analog, mixed-signal and asynchronous design
processor, memory and RF design
DSP and FPGA/ASIC-based design
synthesis and physical design
ATPG, design-for-testability and built-in self test methodologies
embedded system hardware/software co-design and co-verification
CAD/EDA methodologies and tools
statistical timing analysis and low power design methodologies
network and system on-a-chip and applications
communication and wireless sensor networks (WSNs)
specification languages: SystemC, SystemVerilog and UML
theory and foundations: model checking, SAT-based methods, use of PSL, compositional methods and probabilistic methods
applications of formal methods: equivalence checking, CSP applications and transaction-level verification
verification methods based on hardware description/system-level languages (e.g. VHDL, SystemVerilog and SystemC)
industrial experience reports and case studies
real-time, hybrid and embedded systems
all areas of modelling, simulation and verification of systems
formalisms: process algebras, petri-nets, automaton theory and BDDs
software engineering (including real-time Java, real-time UML and performance metrics)
INDUSTRIAL COLLABORATORS AND SPONSORS
The special session is partnered with:
CEOL: Centre for Efficiency-Oriented Languages "Towards improved software timing", University College Cork, Ireland (http://www.ceol.ucc.ie)
International Software and Productivity Engineering Institute, USA (http://www.intspei.com)
Intelligent Support Ltd., United Kingdom (http://www.isupport-ltd.co.uk)
Minteos, Italy (http://www.minteos.com)
M.O.S.T., Italy (http://www.most.it)
Electronic Center, Italy (http://www.el-center.com)
Legalefiscale - Tax & Commercial Law Firm, Italy (http://www.legalefiscale.it)
This special session is sponsored by:
LS Industrial Systems, South Korea (formerly LG Industrial Systems) - http://eng.lsis.biz
Solari, Hong Kong (official sales agent of Sanyo LCD camera modules) - http://www.solari-hk.com
ORGANISER - CHAIRMAN
Dr. Ka Lok Man, University College Cork, Ireland
INTERNATIONAL PROGRAM COMMITTEE
Prof. Vladimir Hahanov, Kharkov National University of Radio Electronics, Ukraine
Prof. Paolo Prinetto, Politecnico di Torino, Italy
Prof. Massimo Poncino, Politecnico di Torino, Italy
Prof. Alberto Macii, Politecnico di Torino, Italy
Prof. Joongho Choi, University of Seoul, South Korea
Prof. Wei Li, Fudan University, China
Prof. Michel Schellekens, University College Cork, Ireland
Dr. Emanuel Popovici, University College Cork, Ireland
Dr. Jong-Kug Seon, System LSI Lab., LS Industrial Systems R&D Center, South Korea
Dr. Umberto Rossi, STMicroelectronics, Italy
Prof. Franco Fummi, University of Verona, Italy
Dr. Graziano Pravadelli, University of Verona, Italy
Yui Fai Lam, Manager, Mircosystems Packaging Institute, University of Science and Technology, Hong Kong
Dr. Vladimir PavLov, International Software and Productivity Engineering Institute, USA
Ajay Patel, Director, Intelligent Support Ltd, United Kingdom
Dr. Jinfeng Huang, Philips & LiteOn Digital Solutions Netherlands, Advanced Research Center, The Netherlands
Dr. Thierry Vallee, Georgia Southern University, Statesboro, Georgia, USA
Dr. Menouer Boubekeur, University College Cork, Ireland
Dr. Ana Sokolova, University of Salzburg, Austria
Dr. Sergio Almerares, STMicroelectronics, Italy
Monica Donno, Director, Minteos, Italy
Prof. Jun-Dong Cho, Sung Kyun Kwan University, South Korea
Prof. AHM Zahirul Alam, International Islamic University Malaysia, Malaysia
Prof. Gregory Provan, University College Cork, Ireland
Dr. Miroslav N. Velev, Aries Design Automation, USA
Prof. M. Nasir Uddin, Lakehead University, Canada
Dr. Alexei Botchkarev, IEEE Canada Board of Directors
Dr. Dragan Bosnacki, Eindhoven University of Technology, The Netherlands
Dr. Dave Hickey, University College Cork, Ireland
Dr. Tomas Krilavičius, Vytautas Magnus University, Lithuania
Dr. Milan Pastrnak, Siemens IT Solutions and Services, Slovakia
Dr. John Herbert, University college Cork, Ireland
Prof. Zhe-Ming Lu, Sun Yat-Sen University, China
Prof. Jeng-Shyang Pan, National Kaohsiung University of Applied Sciences, Taiwan
Prof. Chin-Chen Chang, Feng Chia University, Taiwan
Prof. Mong-Fong Horng, Shu-Te University, Taiwan
Prof. Liang Chen, University of Northern British Columbia, Canada
Prof. Chee-Peng Lim, University of South Australia, Australia
Prof. Ngo Quoc Tao, Vietnamese Academy of Science and Technology, Vietnam
Prof. Suash Deb, C. V. Raman College of Engineering, India
Dr. Salah Merniz, Mentouri University, Constantine, Algeria
Dr. Oscar Valero, University of Balearic Islands, Spain
Prof. Yang Yi, Sun Yat-Sen University, China
Dr. Damien Woods, University of Seville, Spain
Dr. Franck Vedrine, CEA, France
Prof. Bruno Monsuez, ENSTA, France
Prof. Kang Yen, Florida International University, USA
Prof. Takenobu Matsuura, Tokai University, Japan
Dr. R. Timothy Edwards, MultiGiG, Inc., USA
Dr. Olga Tveretina, Karlsruhe University, Germany
Dr. Maria Helena Fino, Universidade Nova De Lisboa, Portugal
Dr. Adrian Patrick O'Riordan, University College Cork, Ireland
Dr. Grzegorz Labiak, University of Zielona Gora, Poland
Prof. M.S. Gaur, Malaviya National Institute of Technology, Jaipur, India
Dr. Jian Chang, Texas Instruments, Inc, USA
Prof. Yeh-Ching Chung, National Tsing-Hua University, Taiwan
Dr. Anna Derezinska, Warsaw University of Technology, Poland
INTERNATIONAL REVIEWERS
Peter Westermann, Technical University of Dortmund, Germany
Tom English, University College Cork, Ireland
Miquel Moreto Planas, Technical University of Catalonia, Spain
Chelho Chung, System Semiconductor/Central R&D Center, LS Industrial Systems, South Korea
Amlan Chakrabarti, University of Calcutta, India
Chi-Un Lei, The University of Hong Kong, Hong Kong
Arkadiusz Bukowiec, University of Zielona Gora, Poland
Mohamed Bamakhrama, Eindhoven University of Technology, The Netherlands
B. Rajendra Naik, Osmania University, India
ORGANISING CHAIRS
Dr. Maria O'Keeffe, University College Cork, Ireland
Michele Mercaldi, M.O.S.T., Italy
PAPER SUBMISSIONS, PROCEEDINGS, INDEXING AND JOURNAL PUBLICATIONS
Prospective authors are invited to submit their draft paper to be limited to a maximum length of 6 page in full paper to ss.datics-AT-gmail.com by 1 December 2008.
The submitted file can be in MS Word format, PS format, or PDF formats. The first page of the draft paper should include:
Title of the paper;
Name, affiliation and e-mail address for each author;
A maximum of 5 keywords of the paper.
Please use the following MS Word Template or Tex Template.
The accepted papers in DATICS'09 be published by IAENG (ISBN: 978-988-17012-2-0) in hardcopy and will be indexed in major database indexes so that it can be assess easily. After the publication of the proceeding, print copies will be sent to databases like IET INSPEC, EBSCO, ISI Thomson Scientific, Engineering Index (EI), The Technology Research Databases (TRD) of CSA (Cambridge Scientific Abstracts), DBLP and Computer Science Bibliographies for indexing.
Expanded and enhanced versions of accepted papers in DATICS'09 can also be considered for inclusion in one of the IAENG journals, the IIUM Engineering Journal, the IBSU Scientific Journal or the IJDATICS Journal.
IMPORTANT DEADLINES
Deadline for full paper submission: 1 December 2008
Notification of acceptance: 1 January 2009
Deadline for authors' registration: 15 January 2009
Deadline for final manuscript submission: 10 February 2009
BECOMING A SPONSOR OF DATICS'09
For information, please contact ss.datics-AT-gmail.com.
TECHNICAL COMMITTEE
If you are interested in joining the DATICS International Program Committee and Reviewers, please submit a brief CV by email to ss.datics-AT-gmail.com.
ENQUIRIES
Please direct all enquiries to ss.datics-AT-gmail.com.
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Last modified: 2010-06-04 19:32:22