IEMT 2012 - 35th IEEE/CPMT International Electronics Manufacturing Technology Conference
Topics/Call fo Papers
The International Electronics Manufacturing Technology (IEMT) Conference is the premier IEEE event devoted to the manufacture of electronic, opto-electronic and MEMS/sensors devices and systems. IEMT is an established International conference of long standing organized by the Components Packaging and Manufacturing Technology (CPMT) Society of IEEE. IEMT 2012 is being organized by the IEEE CPMT Malaysia Chapter with co-sponsorship from CPMT's Santa Clara Valley Chapter.
IEMT 2012 will feature short courses, technical sessions, and exhibitions. It aims to provide good coverage of technological developments in all areas of electronics packaging, from design to manufacturing and operation. IEMT 2012 is an international forum, providing opportunities to network and meet leading experts. Since the 1980's and 1990's, IEMT has gained a reputation as a premier electronics materials and packaging conference and is well attended by experts in the field of electronic packaging from all over the world.
Conference Topics
The topics of interests are specific to manufacturing and
test technology, micro systems/MEMS, their packaging,
electronics materials, board level assembly and
reliability issues. Extended abstracts are being sought
from, but not limited to, the following areas:
? Manufacturing Technologies
? Surface Mount Technology
? Emerging Packaging & Interconnection
Technologies
? IC Testing Technology
? LED, MEMS & Sensor Packaging
? Advanced/3D Packaging
? Wafer Level Packaging/Process
? Materials & Processes
? Modeling & Characterization Technique
(Electrical, Mechanical and Thermal)
? Quality and Reliability
? Cost Effective/Lean Manufacturing
IEMT 2012 will feature short courses, technical sessions, and exhibitions. It aims to provide good coverage of technological developments in all areas of electronics packaging, from design to manufacturing and operation. IEMT 2012 is an international forum, providing opportunities to network and meet leading experts. Since the 1980's and 1990's, IEMT has gained a reputation as a premier electronics materials and packaging conference and is well attended by experts in the field of electronic packaging from all over the world.
Conference Topics
The topics of interests are specific to manufacturing and
test technology, micro systems/MEMS, their packaging,
electronics materials, board level assembly and
reliability issues. Extended abstracts are being sought
from, but not limited to, the following areas:
? Manufacturing Technologies
? Surface Mount Technology
? Emerging Packaging & Interconnection
Technologies
? IC Testing Technology
? LED, MEMS & Sensor Packaging
? Advanced/3D Packaging
? Wafer Level Packaging/Process
? Materials & Processes
? Modeling & Characterization Technique
(Electrical, Mechanical and Thermal)
? Quality and Reliability
? Cost Effective/Lean Manufacturing
Other CFPs
- IEEE International Symposium on Instrumentation and Control Technology
- 9th European Workshop on Microelectronics Education
- 18th International Workshop on Thermal Investigations of ICs and Systems
- 19th International Conference on Mechatronics and Machine Vision in Practice
- IEEE International Conference on Cluster Computing
Last modified: 2012-03-05 16:21:59