THERMINIC 2012 - 18th International Workshop on Thermal Investigations of ICs and Systems

THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. This year THERMINIC will address in addition to the “traditional” thermal management problems, also stress and thermal-stress-related-reliability issues, both in micro- and opto-electronics fields.
AREAS OF INTEREST
include, but are not limited to, the following topics:
Thermal and Temperature Sensors
Acquisition and analysis of Thermal data
Thermal Simulation
Temperature Mapping
Electro-thermal Simulation
Novel and Advanced Cooling Techniques
Thermal Modelling & Investigation of Packages
Thermal Performance of Interconnects
Reliability Issues
Heat Transfer Enhancement
High Temperature Electronics
Validation of Thermal Software
Heat Transfer Education
Coupled (Thermo-mechanical, Thermo-optical, etc.) Effects
Flow Visualisation Techniques
Turbulence Modelling in Complex Geometrics
Thermal Stress: Theory and Experiment
Defect and failure modelling
Thermal Stress Failures: Prediction and Prevention
Reliability evolution and prediction
Multiphysics simulation
Nanotechnology Applications
Nanoengineering issues
Noise control
Education
3DIC, power electronics.
Measurement of Thermal Properties
AUTHORS ARE INVITED
to submit electronic papers describing recent work. Submission will be electronically only. Only papers of PDF (.pdf) format can be submitted.
Submission deadline: 01 April 2012