ASDAM 2018 - 12th International Conference on Advanced Semiconductor Devices and Microsystems
Topics/Call fo Papers
The International Conference on Advanced Semiconductor Devices and Microsystems ASDAM 2018 will be devoted to the latest results of research and development in the field of new semiconductor devices and microsystems. Its goal is to bring together leading experts from institutes and universities as well as companies interested in the progress of high technology devices and microsystems. The Conference Proceedings will be published by the IEEE Electron Devices Society.
Scope of the Conference
Materials and technologies
- semiconductor and dielectric materials
- quantum heterostructures
- MS and MIS structures
- nanostructures and nanotubes, low-dimensional structures
- organic electronics
Structures and devices
- Si-based heterostructure devices
- III-V and III-N heterostructure devices
- quantum and resonance devices, microwave devices, nanodevices
- lasers and photodetectors
- power electronics
Characterization, modelling and simulation
- 2-D and 3-D process, structure and device simulation
- heterostructure device modelling
- structural, optical and electrical characterization of materials, structures and devices
- reliability evaluation and modelling
Sensors and microsystems
- advanced concepts in lithography, plasma etching and deposition techniques
- design and fabrication
- surface and bulk micromachining
- micro(nano)mechanical structures, micro(nano)electro-mechanical systems (MEMS, NEMS)
- SMART Sensors
- sensor characterization, modelling and simulation
Photonics
Scope of the Conference
Materials and technologies
- semiconductor and dielectric materials
- quantum heterostructures
- MS and MIS structures
- nanostructures and nanotubes, low-dimensional structures
- organic electronics
Structures and devices
- Si-based heterostructure devices
- III-V and III-N heterostructure devices
- quantum and resonance devices, microwave devices, nanodevices
- lasers and photodetectors
- power electronics
Characterization, modelling and simulation
- 2-D and 3-D process, structure and device simulation
- heterostructure device modelling
- structural, optical and electrical characterization of materials, structures and devices
- reliability evaluation and modelling
Sensors and microsystems
- advanced concepts in lithography, plasma etching and deposition techniques
- design and fabrication
- surface and bulk micromachining
- micro(nano)mechanical structures, micro(nano)electro-mechanical systems (MEMS, NEMS)
- SMART Sensors
- sensor characterization, modelling and simulation
Photonics
Other CFPs
- 26th INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING
- 2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)
- 49th IEEE Semiconductor Interface Specialists Conference
- 2019 β IInd International Conference on Business, Economics, Law, Language & Psychology (ICBELLP), Feb 06-07, Bangkok
- 2nd Bangkok β International Conference on Research in Social Science & Humanities (ICRSSH), 04-05 Feb 2019
Last modified: 2018-08-23 16:46:33