ISSM 2018 - 26th INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING

Papers on the topics of special interests will be rearranged and will be programmed as a special session for highlight themes. Papers on the following topics are especially welcome. See information on the reverse side.
High reliability device process technology for automotive and medical applications
Technology for an effective screening.
Technology for an Outlier screening.
Rapid failure analysis for an incident.
IoT and AI Solution
IoT and Sensing Technology
Artificial Intelligence (AI) Application
Big Data Application
3D-Architecture and Modules
Technology for Wafer on Wafer
Technology for FOWLP (Fan Out Wafer Level Package)
Integration Technology for Camera Module
Integration Technology for MEMS and Sensors Module
Integration Technology for RF Module
Integration Technology for PMIC Module
Production Innovation in 200-mm Fabs
Optimization of legacy fab
Fab management and utilization of 200mm fab
e-Manufacturing & Design Collaboration
ISSM 2018 addresses the approach from design perspective to manufacturing through our collaboration with eMDC.