CAMME 2018 - 2018 2nd International Conference on Aerospace, Mechanical and Mechatronic Engineering(CAMME 2018)- Ei Compendex & Scopus—Call for papers
Date2018-03-23 - 2018-03-26
Deadline2018-03-05
VenueHanoi, Vietnam, Vietnam
KeywordsAerospace; Mechanical; Mechatronic Engineering
Websitehttps://www.camme.org
Topics/Call fo Papers
●2018 2nd International Conference on Aerospace, Mechanical and Mechatronic Engineering(CAMME 2018)- Ei Compendex & Scopus—Call for papers
March 23-26, 2018. |Hanoi, Vietnam|Website: http://www.camme.org/
●Venue:Hanoi University of Science and Technology, Hanoi,Vietnam
Hanoi University of Science and Technology (HUST; Vietnamese: Đại học Bách khoa Hà Nội, "Hanoi University of Technology (HUT)"), founded 1956, is the first and largest technical university in Vietnam
●CAMME 2018 provides researchers and industry experts with one of the best platforms to meet and discuss groundbreaking research and innovations in the field of Aerospace, Mechanical and Mechatronic Engineering.
International invited speakers are invited to present their state-of-the-art work on various aspects, which will highlight important and developing areas.
●Publication and Indexing
All accepted papers will be published in the digital conference proceedings(IOP Conference Series: Materials Science and Engineering) which will be Indexed by all major citation databases such as Conference Proceedings Citation Index – Science (CPCI-S),(Thomson Reuters, Web of Science), Scopus, Ei Compendex, Inspec, INIS (International Nuclear Information System), Chemical Abstracts, NASA Astrophysics Data System, Polymer Library, etc.
A selection of best papers with extended versions will be recommended to publish in journals.
●Program Preview/ Program at a glance
March. 23, 2018: Registration + Icebreaker Reception
March. 24, 2018: Opening Ceremony+ KN Speech+ Technical Sessions
March. 25, 2018: Technical Sessions+ Half day tour/Lab tours
March. 26,2018: One day tour
●Paper Submission
1. PDF version submit via CMT: https://cmt3.research.microsoft.com/User/Login?Ret...
2. Submit Via email directly to: camme-AT-iased.org
●CONTACT US
Ms. Betty.Y.Chen
Email:camme-AT-iased.org
Website: http://www.camme.org/
March 23-26, 2018. |Hanoi, Vietnam|Website: http://www.camme.org/
●Venue:Hanoi University of Science and Technology, Hanoi,Vietnam
Hanoi University of Science and Technology (HUST; Vietnamese: Đại học Bách khoa Hà Nội, "Hanoi University of Technology (HUT)"), founded 1956, is the first and largest technical university in Vietnam
●CAMME 2018 provides researchers and industry experts with one of the best platforms to meet and discuss groundbreaking research and innovations in the field of Aerospace, Mechanical and Mechatronic Engineering.
International invited speakers are invited to present their state-of-the-art work on various aspects, which will highlight important and developing areas.
●Publication and Indexing
All accepted papers will be published in the digital conference proceedings(IOP Conference Series: Materials Science and Engineering) which will be Indexed by all major citation databases such as Conference Proceedings Citation Index – Science (CPCI-S),(Thomson Reuters, Web of Science), Scopus, Ei Compendex, Inspec, INIS (International Nuclear Information System), Chemical Abstracts, NASA Astrophysics Data System, Polymer Library, etc.
A selection of best papers with extended versions will be recommended to publish in journals.
●Program Preview/ Program at a glance
March. 23, 2018: Registration + Icebreaker Reception
March. 24, 2018: Opening Ceremony+ KN Speech+ Technical Sessions
March. 25, 2018: Technical Sessions+ Half day tour/Lab tours
March. 26,2018: One day tour
●Paper Submission
1. PDF version submit via CMT: https://cmt3.research.microsoft.com/User/Login?Ret...
2. Submit Via email directly to: camme-AT-iased.org
●CONTACT US
Ms. Betty.Y.Chen
Email:camme-AT-iased.org
Website: http://www.camme.org/
Other CFPs
- 2018 2nd International Conference on Engineering Physics and Optoelectronic Engineering (ICEPOE 2018)
- 8th International Workshop on Programming Models and Applications for Multicores and Manycores
- 12th ACM SIGPLAN Workshop on Transactional Computing / 9th Workshop on the Theory of Transactional Memory
- 2017 International Conferences on Logic for Programming, Artificial Intelligence and Reasoning
- 18th IEEE International Workshop on Signal Processing Advances in Wireless Communications
Last modified: 2018-03-17 18:54:38