APCMP 2010 - APCMP2010 - The 9th Asia-Pacific Conference on Materials Processing

Following the success of the previous eight conferences, APCMP2010 will provide another opportunity for researchers and industrial practitioners from around the world to interchange information on the latest development and applications in the science and technologies of materials processing. Specifically, this conference focuses on material forming in the melt, near-melt or powder state, material subtractive and additive processes, as well as other advanced processes including micro- and nano-fabrication for metals, ceramics, polymers, composites, semiconductors and biomaterials.

Papers are sought in, but not limited to, the following areas:
Material forming processes, including sheet metal forming, bulk forming, powder forming, and casting.
Material subtractive processes, including cutting, grinding, lapping, polishing, ECM, EDM, and other material removal processes.
Material additive processes, including rapid prototyping, surface coating, thin film etc.
Materials joining processes.
Computer-aided design, manufacturing, and engineering (CAD/CAM/CAE) related to materials processing.
Analytical and numerical methods related to materials processing.
Advanced materials (such as composites, polymers, Semiconductors, micro-electronic materials, and bio-materials) processing.
Micro- and nano-fabrication science and technologies, including nano-structuring and nano-patterning.