TEI 2017 - 11th International Conference on Tangible, Embedded, and Embodied Interaction

TEI 2017 is the 11th annual conference dedicated to presenting the latest results in tangible, embedded, and embodied interaction. It will be held 20th to 23th March 2017 hosted at Keio University in Yokohama, Japan.
The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, design, interactive art, user experience, tools and technologies. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances.
TEI is sponsored by ACM SIGCHI, in collaboration with Keio University Graduate School of Media Design, known as Keio Media Design or KMD.