EEETEM 2017 - Third International Conference on Electrical and Electronic Engineering, Telecommunication Engineering, and Mechatronics (EEETEM2017)

Third International Conference on Electrical and Electronic Engineering, Telecommunication Engineering, and Mechatronics (EEETEM2017) that will be held in Beirut, Lebanon, on April 26-28, 2017. The event will be held over three days, with presentations delivered by researchers from the international community, including presentations from keynote speakers and state-of-the-art lectures.
The conference welcome papers on the following (but not limited to) research topics:
Electronics Engineering
Artificial Intelligence Bioinstrumentation: Sensors, Micro, Nano and Wearable Technologies
Circuits and Electronics Communications and Networking
Computer Architecture for Intelligent Machines Device Electronics for I.C
Electronic Medical Devices Electronics & Nano Electronics
Electronics System-Level Based Design FPGA and Reconfigurable Architecture based System
Fiber Optics and Fiber Devices High Performance VLSI Systems
Integrated Optics Intelligent Transportation Systems
Low-Power Signal Processing Micro/Nano Systems and Networks
Mobile Computing Multimedia Services and Technologies
Networks Design, Protocols and Management Optical Electronic Devices & Photonics
Radio-Frequency Integrated Circuits Robotic Systems
System on Chips and Network on Chips Techniques of Laser and Applications Of Electro-optics
Electrical Engineering
Analog Circuits and Digital Circuits Analysis of Power Quality and System Stability
Antenna and Propagation Battery Management System
Bioinformatics & Biomedical Imaging Biomedical Signal Processing
Brain-Computer Interfacing and Human?Computer Interfacing Computer Relaying
Computer-Aided Surgery Data Compression and Watermarking
Electric Energy Processing Electro-optical Phenomena of Semiconductors
Electromagnetic and Photonics Expert Systems
Health Care Information Systems Healthcare Information Systems, Telemedicine
Image Processing Information Security and Cryptography
Integrated Optics and Electro-optics Devices Internet and web solutions for healthcare
Microwave Theory and Techniques Microwave and millimeter circuit and Antenna
Mobile Security Modeling, Simulation, Systems and Control
Modulation, Coding, and Channel Analysis Multimedia Signal Processing
Natural Language Processing Neural Networks
Parallel Programming & Processing Power Electronics
Power IC Remote control and techniques of GPS
Robotics and Atomization Engineering Signal Integrity Design for High-Speed Digital Systems
Signal Processing Simulation of Propagation
Smart Grid Speech Analysis and Synthesis
Speech Recognition Wireless Communication
Mechatronics
Applications of AI Techniques in Design and Manufacturing Diagnosis and Monitoring in Mechatronic Systems
Automation Mechanical Engineering
Industrial Engineering Micro-Machining
Instrumentation and Control Mechatronics
Modeling and Design Nano Technology
Robotics and Automation Control, Robotics And Mechatronics
Robotics and Mobile Machines Design and Manufacturing
Dynamic Systems and Control Mechatronics and Intelligent Machines
Globalization of Engineering Microsystems Integration
NanoEngineering for Energy Nano and Micro Materials, Devices and Systems
Computer-aided design, manufacturing, and engineering Fault detection and Diagnosis in Mechatronics Systems
Automobile technology Autonomous Systems and Ambient Intelligence
Bio-Mechatronics Machining
Design and Green Manufacturing Intelligent Processing of Materials
Human-Machine Interface Micro-electro Mechanical Systems and Devices
Micromachining and Microsystem technology Micromechatronics
All registered papers will be published in SDIWC Digital Library, and in the proceedings of the conference.
All submitted papers will be reviewed by a minimum of two reviewers. The published proceedings will be submitted for indexing in ResearchBib. In addition, they will be reviewed for POSSIBLE inclusion within the INSPEC, EI, DBLP, Microsoft Academic Research, ResearchGate, and Google Scholar Databases.