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NOCS 2015 - 2015 International Symposium on Networks-on-Chip

Date2015-09-28 - 2015-09-30

Deadline2015-05-08

VenueVancouver, Canada Canada

Keywords

Websitehttps://nocs2015.eecs.wsu.edu

Topics/Call fo Papers

NOCS is the premier forum for researchers to present their latest findings in the area of Networks-on-Chip.
The International Symposium on Networks-on-Chip (NOCS) is the premier event dedicated to interdisciplinary research on on-chip, chip-scale, and multichip package-scale communication technology, architecture, design methods, applications and systems. NOCS brings together scientists and engineers working on NoC innovations and applications from inter-related research communities, including computer architecture, networking, circuits and systems, packaging, embedded systems, co-design, and design automation. Topics of interest include, but are not limited to:
NoC Architecture and Design
Network architecture (topology, routing, arbitration)
NoC Quality of Service
Timing, synchronous/asynchronous communication
Network interface issues
NoC design methodologies and tools
Mapping of applications onto NoCs
Signaling & circuit design for NoC links
NoC Application
NoC case studies application-specific NoC designs
NoC designs for heterogeneous many-core systems, fused CPU-GPU architectures, FPGA-based systems etc
NoC Analysis, Verification and Modeling
NoC Analysis, Verification and Modeling
Modeling, simulation, and synthesis of NoCs
Verification, debug & test of NoCs
Metrics and benchmarks for NoCs
Scalable modeling of NoCs
NoC at the Un-Core and System-level
Design of memory subsystem (un-core) including memory controllers, caches, cache coherence protocols & NoCs
NoC support for memory and cache access
OS support for NoCs
Programming models including shared memory, message passing and novel models
Issues related to large-scale systems (datacenters, supercomputers) with NoC-based systems as building blocks
Novel NoC Technologies
New physical interconnect technologies, e.g., carbon nanotubes, wireless NoCs, through-silicon, etc.
NoCs for 3D and 2.5D packages
Package-specific NoC design
Optical, RF, & emerging technologies for on-chip/in-package interconnects
NoC Optimization
for power/energy efficiency
for thermal efficiency and darksilicon
for dependable architectures
for communication efficient algorithms

Last modified: 2015-05-04 08:46:32