TAIN 2015 - Symposium on Technologies and Applications of the Internet (TAIN)

The Internet has revolutionized and changed the way we communicate, socialize, entertain, access information and conduct business. It has evolved into a pervasive ecosystem of connected computers, mobile gadgets, sensors, home appliances, and a variety of other devices. This evolution has led to a deep intertwining of the physical, social and digital worlds, raising new research agendas and challenging our understanding of the requirements for a vastly interconnected world. TAIN symposium provides a forum to share latest innovations on Internet technologies and applications. Topics of interest include, but are not limited to: wireless, mobile, ad-hoc and sensor networks and applications; Internet of things (IoT) and machine-to-machine (M2M) communications; peer-to-peer (P2P), overlay, cloud and content distribution networks (CDN); network security, authentication, assurance and trusted communication; network protocol and architectures; network simulation, measurement, administration and management; emerging network technologies such as software defined network (SDN).
TAIN Organizing Committee
General Chair: Schahram Dustdar, Vienna University of Technology, Austria
Program Chairs: Ying Cai, Iowa State University, USA
Tugkan Tuglular, Izmir Institute of Technology, Turkey
Steering Committee Rep: Katsuyuki Yamazaki, Nagaoka University of Technology, Japan
Standing Committee Rep: Katsuyuki Yamazaki, Nagaoka University of Technology, Japan
Program Committee
Toyokazu Akiyama, Kyoto Sangyo University, Japan
Shigehiro Ano, KDDI R&D Laboratories, Japan
Ying Cai, Iowa State University, USA
Shuo-Yan Chou, National Taiwan University of Science & Technology, Taiwan
Kazutoshi Fujikawa, Nara Institute of Science & Technology, Japan
Shigeki Goto, Waseda University, Japan
Katsuyoshi Iida, Tokyo Institute of Technology, Japan
Takeshi Ikenaga, Kyushu Institute of Technology, Japan
Norihiro Ishikawa, Komazawa University, Japan
Sinchai Kamolphiwong, Prince of Songkla University, Thailand
Mei Kobayashi, IBM Research
Kaori Maeda, Hiroshima City University, Japan
Hiroyoshi Miwa, Kwansei Gakuin University, Japan
Shigeru Miyake, Hitachi, Ltd., Japan
Motonori Nakamura, NII, Japan
Yutaka Nakamura, Kyushu Institute of Technology, Japan
Kouji Nishimura, Hiroshima University, Japan
Hiroyuki Ohsaki, Kwansei Gakuin University, Japan
Yasuo Okabe, Kyoto University, Japan
Matsuura Satoshi, Nara Institute of Science & Technology, Japan
Hideaki Sone, Tohoku University, Japan
Hideki Sunahara, Nara Institute of Science & Technology, Japan
Michiharu Takemoto, NTT, Japan
Yuuichi Teranishi, Osaka University, Japan
Fumio Teraoka, Keio University, Japan
Masato Tsuru, Kyushu Institute of Technology, Japan
Tugkan Tuglular, Izmir Institute of Technology, Turkey
Kenzi Watanabe, Hiroshima University, Japan
Nariyoshi Yamai, Okayama University, Japan
Hiroshi Yamamoto, Nagaoka University of Technology, Japan
Takashi Yamanoue, Kagoshima University, Japan
Katsuyuki Yamazaki, Nagaoka University of Technology, Japan