ECPE 2015 - Symposium on Embedded & Cyber-Physical Environments (ECPE)

The Embedded & Cyber-Physical Environments Symposium brings together researchers and practitioners to create systems that consist of disparate components, using disparate metrics and methods. These systems have deeply embedded distributed computation in distributed infrastructures ranging in scale from micro to very large. Such systems contain not only complex physical dynamics (physical systems), but non-trivial distributed computation (cyber systems) and communication (network systems). COMPSAC is uniquely positioned to host the diverse elements necessary to properly engineer such systems; the foundations, methodologies, and mechanisms that support the design, modelling, and evaluation of software systems must come from diverse sources. Topics of interest include requirement analysis, co-analysis, co-design and co-verification, modeling, design, development, testing, measurement, verification and validation for performance, safety, security, and dependability constraints . Effective construction of these systems is not limited solely to the field of computer science and engineering and is truly a multidisciplinary effort. Multidisciplinary work, research and development software prototypes, industry-university collaborations, all based on new emerging and critical technologies will be of particular interest to this symposium.
ECpE Organizing Committee
General Chairs: Tiberiu Seceleanu, ABB, Sweden
Aditya Mathur, Purdue University, USA
Program Chair: Rajesh Subramanyan, Siemens AG, USA
Steering Chair: Cristina Seceleanu, Mälardalen University, Sweden
Standing Committee Rep: Bruce McMillin, Missouri University of Science & Technology, USA
Program Committee
Xiaoying Bai, Tsinghua University, China
Fevzi Belli, University of Paderborn, Germany
Jan Bosch, Chalmers University of Technology, Sweden
Chun-Hsian Huang, National Taitung University, Taiwan
Ron Kennett, KPA Ltd., University of Torino, Italy
Yves Le Traon, University of Luxembourg, Luxembourg
Bruce McMillin, Missouri University of Science & Technology, USA
Hideya Ochiai, The University of Tokyo, Japan
Daniel Tauritz, Missouri University of Science & Technology, USA
Feng-Jian Wang, National Chiao-Tung University, Taiwan
Tao Yue, Simula Research Laboratory, Norway
Contact ECPE Organizers: cs_compsac-ECPE-2015-AT-iastate.edu