EMPC 2015 - 20th European Microelectronics and Packaging Conference & Exhibition
Date2015-09-14 - 2015-09-16
Deadline2015-01-15
VenueFriedrichshafen, Germany
KeywordsMicroelectronics; Packaging
Websitehttps://www.empc2015.org
Topics/Call fo Papers
Si and Glass Interposers & 2.5?/?3D Packaging
The Future of Packaging
Advanced Packaging, Interconnects & Assembly / Application Fields
Materials & Processes
Modeling, Design, Test & Reliability
The Future of Packaging
Advanced Packaging, Interconnects & Assembly / Application Fields
Materials & Processes
Modeling, Design, Test & Reliability
Other CFPs
Last modified: 2014-10-22 20:56:29