APPED 2010 - 2010 Asia-Pacific Conference on Power Electronics and Design (APPED 2010)
Topics/Call fo Papers
1.1. Technologies and Digital Circuits
Emerging logic & memory technologies and applications,
Device design, Low power low leakage circuits,
Memory circuits, Cooling technologies, Battery
technologies, Variation-tolerant design, Temperatureaware and reliable design
1.2. Design Tools
Energy simulation and estimation tools that operate at
the circuit/gate level, RT level, behavioral level, and
algorithmic level, Variation-aware design, Physical design and interconnects
1.3. Logic and Microarchitecture Design
Processor core design, Cache design, Logic and RTL
design, Arithmetic and signal processing circuits,
Encryption technologies, Asynchronous design
1.4. System Design and Methodologies
Microprocessor, DSP and embedded systems design,
FPGA and ASIC designs , Emerging applications,
Server thermal management, System level power
management, Behavioral and system level design aids
1.5. Analog, MEMS and Mixed Signal Electronics
RF circuits, Wireless, MEMS circuits, AD/DA
Converters, Mixed-signal circuits, DC-DC conversion
1.6. Software Design and Optimization
Power aware compiler and operating system design,
Application level optimizations, Wireless and sensor networks
Emerging logic & memory technologies and applications,
Device design, Low power low leakage circuits,
Memory circuits, Cooling technologies, Battery
technologies, Variation-tolerant design, Temperatureaware and reliable design
1.2. Design Tools
Energy simulation and estimation tools that operate at
the circuit/gate level, RT level, behavioral level, and
algorithmic level, Variation-aware design, Physical design and interconnects
1.3. Logic and Microarchitecture Design
Processor core design, Cache design, Logic and RTL
design, Arithmetic and signal processing circuits,
Encryption technologies, Asynchronous design
1.4. System Design and Methodologies
Microprocessor, DSP and embedded systems design,
FPGA and ASIC designs , Emerging applications,
Server thermal management, System level power
management, Behavioral and system level design aids
1.5. Analog, MEMS and Mixed Signal Electronics
RF circuits, Wireless, MEMS circuits, AD/DA
Converters, Mixed-signal circuits, DC-DC conversion
1.6. Software Design and Optimization
Power aware compiler and operating system design,
Application level optimizations, Wireless and sensor networks
Other CFPs
- 2010 2nd International IEEE Consumer Electronics Society's Games Innovations Conference (ICE-GIC 2010)
- IEEE International High-Level Design, Validation and Test Workshop HLDVT 2010
- Sixth International Conference on Hot-Wire Chemical Vapor Deposition (Cat-CVD) Process HWCVD 2010
- International Conference in Wireless and Ubiquitous Systems
- International Workshop on Cognitive Radio (CR)
Last modified: 2010-06-04 19:32:22