BGID 2013 - International Workshop on Bond Graph for Integrated Design of Engineering Systems

Bond graph methodology is a graphical language unified for all physical domains. It is a performing tool well adapted for innovating product designing or improvement of existing ones. This is why this multi-physic modelling and simulation tool is widely used by industrials not only for modelling but also for integrated design of intelligent systems. In the present workshop presented by industrial and academic experts, it will be shown how the bond graph tool can be used for dynamic and automated modelling, health monitoring and design of supervision design of test rigs applied to aeronautic systems. The presentations will be illustrated by industrial applications and dedicated software.
Program:
9h-12h30h. Bond Graphs for Modeling and Control Analysis: Application to Mechatronic Systems.
Professor G. Dauphin Tanguy, Ecole Centrale de Lille, France.
The basic principles and tools of the bond graph methodology will be presented. It will be pointed out how causality properties are shown up on the bond graph by means of the causal stroke, allowing the building of mathematical models from the bond graph and the implementation of graphical procedures for structural analysis purposes. Several industrial applications will be briefly shown up.
14h-17h. Bond Graphs for Design of Supervision Systems: Application to Process Engineering.
Professor B. Ould Bouamama, Ecole Polytechnique de Lille, France.
The term Supervision means a set of tools and methods used to operate an industrial process in normal and faulty situation. It will be shown how the bond graph tool because of its causal and structural properties can be used for modeling and diagnosis algorithms generation. A specific software developed by the author will be presented and tested to a pedagogical and real processes to be monitored.