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TEI 2014 - Eighth International Conference on Tangible, Embedded, and Embodied Interaction
Date2014-02-16 - 2014-02-19
Deadline2013-08-01
VenueMunich, Germany 
Keywords
Websitehttps://www.tei-conf.org/14/
Topics/Call fo Papers
TEI 2014 is the eighth international conference dedicated to presenting the latest results in tangible, embedded, and embodied interaction. It will be held 16th to 19th February 2014 at the Ludwig-Maximilians-Universität München (LMU), Munich, Germany.
The work presented at TEI addresses HCI issues, design, interactive art, user experience, tools and technologies, with a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances.
TEI is sponsored by the ACM SIGCHI.
The work presented at TEI addresses HCI issues, design, interactive art, user experience, tools and technologies, with a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances.
TEI is sponsored by the ACM SIGCHI.
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Last modified: 2013-03-27 23:19:23