HBC&BSP 2013 - The International Workshop on Human Body Communications and Biomedical Signal Processing

Human Body signal collection, processing and communication theory, technology for Biomedical and healthcare applications, Body Area Network (BAN) technology and services are the focus of IEEE Workshop on Human Body Communications and Biomedical Signal Processing 2013 (HBC&BSP 2013).
The HBC&BSP 2013 workshop aims at sharing theoretical, experimental and operational results in Human Body information and communication engineering, Body Area Network (BAN), Biomedical Signal Processing, and other related topics to be considered.
Novel papers are invited from both academic and industrial research institutions, describing original results, new technical implementations, or in-depth user studies, including but not limited to, the following:
(01) HBC theory, technologies, protocol and solutions
(02) BAN technology and services
(03) Biomedical Signal collection, processing and transmission
(04) Gene Circuits theory, technologies
(05) Emotional information processing
(06) Biochip, Sensors and terminal design
(07) Cognitive radio for wireless BAN
(08) Telemedicine, telemonitoring, telesurgery
(09) Rehabilitation and activity monitoring
(10) Hospital data networks and wireless hospital
Authors are invited to submit papers (IEEE standard format, max 6 pages). The IEEE templates can be found at:
http://www.ieee.org/conferences_events/conferences...
The submission deadline is April 30, 2013. All submissions should be written in English, the PDF file of your paper should be sent to: wxiang-AT-pku.org.cn
All papers will be reviewed by the Program Committee, which will assess significance, originality, accuracy, and clarity. Workshop proceedings will be published in the proceedings of iThings'13 by IEEE Computer Society (EI indexed). Extended versions of selected papers will be considered for publication in several SCI-index international journals.
General Co-Chairs:
Xiang Wang, Beihang University, China
Executive Co-Chairs:
Huan Li, Beihang University, China
Lei Wang, Shenzhen Institutes of Advanced Technology, CAS, China (to be invited)
Organizing Committee:
Guozhou (Joe) Chen, Princeton University, USA
Xia Mao, Beihang University, China
Zheng Zheng, Beihang University, China
Qingwen Li, Oxford University, United Kingdom
Jiansheng Liu, Beihang University, China
Zhan Zhao, Institute of Electronics, CAS, China
Ikdong Kim, Princeton University, USA
Ziou Wang, University of Minnesota, USA
Tongsheng Xia, Beihang University, China
Guangqian Yuan, University of Connecticut, USA
Tao Shang, Beihang University, China
Rui Guo, West Virginia University, USA
Bin Xu, Beihang University, China
Catalin-Daniel Caleanu, Polytechnic University of Timisoara, Romania
Zhiying Liu, Beihang University, China
Zexi Zhao, Beihang University, China
Technical Program Committee:
Xinxia Cai, Institute of Electronics, CAS, China
Lei Huang, OFS FITEL LLC, USA
Juan Li, Peking University, China
Edward KW, Carleton College, USA
Ziou Wang, Soochow University, China
Lijiang Chen, Beihang University, China
Chi Zhang, University of Tennessee, USA
Min Zeng, Academy of Military Medical Sciences, China
I D Kim, Sangmyung University, Korea
Xiaomin Cheng, University of Minnesota, USA
Angelo Compare, University of Bergamo, Italy
Xinghua Wang, Beijing Institute of Technology, China