ICEP201 2010 - ICEP2010 International Conference on Electronics Packaging

ICEP2010 International Conference on Electronics Packaging
May 12 -14, 2010
Sapporo Convention Center, Hokkaido, Japan
Sponsored by JIEP, and IEEE CPMT Society Japan Chapter
Technical Topics for Conference Papers
Sessions and Keywords:
1. Advanced Packaging
Area array packages, SiP, PoP, PiP, wafer level packaging, system
integration, LCD modules, MCM, and System on Package
2. Substrate
Laminates, interposers, fine pitch, build-up substrates, FPC (Flexible
Printed Circuits), embedded, conductive paste, thin core, coreless,
low CTE, and thin film wiring
3. Design, Modeling, and Reliability
Signal integrity, power integrity, thermal management, high speed
board design, reliability, failure analysis, testing, evaluation, and
EDA
4. Manufacturing and Process
Flip chip, plating, inkjet, process control, equipment, thin films,
underfills, encapsulation, molding, and fluxes
5. Interconnection
Flip chip, wire bonding, soldering, bump formation, NCF/NCP,
ACF/ACP and fluxless joining
6. Optoelectronics
Photonic devices, optical fibers, wave guides, optical interconnects,
transceivers, connectors, LD/PD, LED, OE/EO, TOSA/ROSA,
WDM, and optical wiring boards
7. Printed Electronics
Inkjet, screen printing, conductive wiring, insulation, printed organic
TFT, and device applications
8. 3D and TSV
Silicon stacking, Chip on Chip, Chip on Wafer, Wafer on Wafer, TSV,
via formation and filling, wafer thinning, wireless interconnection,
and 3D LSI design and CAD system
9. MEMS/Sensor
MEMS/Sensor devices, process, assembly and packaging, system
integration, and MOEMS
10. Self-Organization/Self-Assembly
Nano materials/devices by self-organization/self-assembly,
Dissipative structures, hierarchical structures, bottom-up manufacturing
Bio-mimetic, nature-oriented processes/design/applications
11. Emerging Technologies
Nano technology, and organic semiconductors
12. RF
RFID, high frequency devices, packaging, filters, EMI, EMC, and
antennas
13. Automotive Electronics
Power devices, power electronics, ECU, sensors, lead free solder, and
wire harness
14. Energy and Environment
PV, lead free, fuel cells, power electronics, and power devices
15. Others
Market trends, environmentally conscious product and processes, and
cost analysis
Abstract and Paper Submission:
300-word abstract to be submitted to the secretariat by e-mail or fax by November 15, 2009
Notification of acceptance by the middle of December, 2009
Final manuscript to be submitted by March 19, 2010
Registration Fees:
Speakers: 40,000 yen (including reception and the proceedings)
Students: 5,000 yen (including the proceedings)
Organizing Committee:
General Chair: M. Mori, Toshiba
Vice General Chairs: Y. Orii, IBM Japan and M. Nakamura, Hitachi
Contact:
Secretariat of ICEP 2010
JIEP (Japan Institute of Electronics Packaging)
E-mail: icep2010-AT-jiep.or.jp
URL: http://www.jiep.or.jp/icep/
Abstract Submission Form
Please attach this form to your abstract
Paper Title:
Session Preference:
Primary Session Name :
Secondary Session Name :
Keywords :
Presentation Style : □Oral □Poster (Student only)
Submitted papers may be assigned to other/additional sessions at the discretion of the technical program committee.
You may select up to five keywords.
Author Information:
Prefix: Prof. [ ], Dr. [ ], Ms. [ ], Mr. [ ] / [ ] Student
First Name Last Name
Name:
Membership No.: JIEP IEEE
Company or Institution:
Department or Division:
Address:
Zip Code: Country:
Phone: Fax:
E-mail:
Publication Schedule:
300-word abstract submission deadline: November 15, 2009 by e-mail or fax
Notification of acceptance: middle of December, 2009
Submission of final manuscript: March 19, 2010
Please send your abstract and this form by e-mail or fax.
Fax: +81-3-5310-2011, E-mail: icep2010-AT-jiep.or.jp
ICEP2010