RSAFP 2013 - 22nd Reliability, Stress Analysis, and Failure Prevention Conference (RSAFP)

As an integral part of the IDETC/CIE 2013, the 22nd Reliability, Stress Analysis, and Failure Prevention Conference (RSAFP) is being sponsored by the Technical Committee on Reliability, Stress Analysis, and Failure Prevention, which is an integral part of the ASME Design Engineering Division. This event is the theme of the odd-year IDETC and premier international meeting in the fields of reliability, stress analysis, and failure prevention. This year’s RSAFP Conference includes topics covering considerations in design process; computer-based (numerical/FEA, etc.) analyses for RSAFP; material considerations for RSAFP (with possible sessions on nanocomposites, polymer-based designs, composites, polymer processing, and functional materials); safety and reliability in design, RSAFP issues in adhesive joints, bolted connections and threaded joints, stress analyses; failure analyses and modeling; and RSAFP issues in microelectromechanical and nanoelectromechanical systems.