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MPIA 2012 - Special Session Materials Problems in Industry Applications

Date2012-10-10

Deadline2012-06-01

VenueCairo, Egypt Egypt

Keywords

Websitehttps://icet-guc.org/2012

Topics/Call fo Papers

Materials Problems in Industry Applications
The scope of the following session is to give knowledge of the progress in materials related to industry, which focuses in Mechanical behavior of Metals and alloys. Session will contains research for ferrous and nonferrous alloys. Casted, welded and composites alloys will be included in the session. This symposium will focus on deformation, damage, and fracture at room temperature and elevated temperatures in their service environments. The Symposium topics will include, but are not limited to the following:
Mechanical behavior of materials in metals and alloys subjected to various loading conditions and effects on live time.
Corrosion, Fatigue, wear, creep and fretting behavior, causes, fundamentals and prevention.
) Heat treatment effects, Nondestructive test in research and industry.
Understanding mechanical behavior across different length scales is a lively area of current research including nanostructures and thin films, hierarchical and bio-inspired microstructures, multi-scale modeling and small crack effects.
Behavior of materials after, Casting, welding and formation (rolling, drawing, forging and extrusion).
Organizers
Yasser Fouad, PhD, Faculty of Materials Science and Engineering, German University in Cairo.
Ahmed El-Sheikh, Faculty of Engineering, Cairo University.
Ahmed Abd El-Aziz, Prof, Faculty of Materials Science and Engineering, German University in Cairo.Paper Submission
Papers should be submitted electronically. For further details, please consult the conference paper submission web page. When you submit your paper, please select “SS-4: Materials Problems in Industry Applications” from the “Topics” list in the submission page. All articles will undergo a rigorous review process. Accepted papers will be published in the conference memory stick and on the IEEE Xplore.

Last modified: 2012-05-15 23:48:35