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HOTI 2012 - 2012 IEEE 20th Annual Symposium on High-Performance Interconnects (HOTI)

Date2012-08-22

Deadline2012-05-13

VenueSanta Clar, USA - United States USA - United States

Keywords

Websitehttps://www.hoti.org

Topics/Call fo Papers

Join us for our 20th year of an information-packed three-day Symposium about the latest in High Performance Interconnects. IEEE Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field.
Two days of technical sessions and a day of tutorials are waiting for you, to keep you on the top of the latest developments in industry and academia.
Our objective is to address the Data-Center Networking and the Supercomputing communities. This year we are proud to have Patrick Geoffray, Myricom, and Hamid Ahmadi, Huawei, as our 2012 IEEE Hot Interconnects General Chairs.
We hope you can join us and benefit not only by the content but also by the prime networking opportunities this event always offers.
2012 Important Dates
May 13, 2012 Deadline for paper submission
June 16, 2012 Notification of paper acceptance

Last modified: 2012-04-14 13:51:03