MP3 2012 - 2nd International Conference on Frontiers of Manufacturing with Photons, Energetic Particles and Power fields in 2012 (MP3 2012)

General Co-Chairs：
Xiaoyan ZENG，Huazhong University of Science and Technology (HUST) and WNLO, China
Reinhart Poprawe, Fraunhofer ILT, Aachen, Germany
International Advisory Committee:
Eckhard Beyer, Fraunhofer IWS, Dresden, Germany
Friedrich Dausinger, Institut für Strahlwerkzeuge, Stuttgart, Germany
Walter W. Duley, Universityof Waterloo, Waterloo, ON, Canada
Qiao Guan,BABMI, Beijing, China
Gnian Cher Lim, Singapore Institute of Manufacturing Technology, Singapore
Shang Yang Lin, HarbinWelding Institute, Harbin, China
Wenjin Liu, TsinghuaUniversity, Beijing, China
Bingheng Lu,Xi’An Jiaotong University, Xi’an, China
Hau-Chung Man, Hong KongPolytechnic University, Hong Kong, China
Jyoti Mazumder, CLAIM, The University of Michigan, Ann Arbor, MI, USA
John Powell, Laser Expertise Ltd., Nottingham, UK
Chris Smallbone, Welding Technology Institute of Australia, Silverwater, Australia
William M. Steen, The University of Liverpool, Liverpool, UK
Guobiao Wang, National Natural Scientific Foundation of China, China
Maocai Wang, Instituteof Metal Research, Chinese Academy of Sciences, Shenyang, China
Youliang Wang, Laser Processing Committee of China Optical Society, China
Bingkun Zhou, Qsinghua University, China
Tiechuan Zuo, Beijing University of Technology, China
Symposium 1: Advanced Laser Technology and DevicesSymposium
Co-Chairs:
Xiao Zhu, HuazhongUniversityof Science and Technology
Keming Du, Edge-wave Company, Germany
Program Committee Members：
Mali Gong, Qsinghua University, Beijing, China;
Kovsh Ivan, Russia Laser Association, Russia,
Xuechun Lin, Semiconductor Institute，CAS, Beijing, China;
Bill Shiner，IPG Photonics, Germany,
Youqing Wang, Huazhong University of Science and Technology, Wuhan, China;
Dapeng Yan, Raycus Fiber Laser Company, Wuhan, China；
Zhigang Zhang, Beijing University, Beijing, China;
Jun Zhou, Shanghai Institute of Optics and Fine Mechanics, CAS, China
Concerned Technical Topics may include, but are not limited to:
High Power CO2 Lasers,
RF Disc Laser; Diode Laser,
Diode-pumped Laser,
Disc Laser,
Excimer Laser,
Fiber Laser,
New Laser Sources;
Ultrafast (Picosecond & Femtosecond);
Sensing and Monitoring;
Laser Materials, Fabrication and Characterization
Novel lasers and their new applications
Symposium 2：Laser Macro Materials Processing Symposium
Co-Chairs:
Minlin Zhong, Tsinghua University
Lin Li,Manchester University
Program Committee Members：
Milan Brandt, Swinburne University of Technology, Melbourne, Australia
Genyu Chen,Hunan University, Changsha, China;
Yanbin Chen, Harbin Institute of Technology, Harbin, China;
Shuili Gong, BABMI, Beijing, China;
Weidong Huang, Northwestern Polytechnic University, Xian, China;
Stefan Kaierle, Laser Zentrum Hannover e.V., Germany;
Ingomar Kelbessa, RWTH Aachen Univ., Aachen, Germany;
Seiji Katayama, Osaka University, Ibaraki, Osaka, Japan,
Hau-Chung Man, Hong Kong Polytechnic Univ., Hung Hom, Kowloon, Hong Kong, China;
Huaming Wang, Beihang University, Beijing, China
Yixiong Wu, Shanghai Jiaotong University, Shanghai, China;
Rongshi Xiao,Beijing University of Technology, Beijing, China;
Yongqiang Yang, Huanan Univ. of Technology, Guangzhou,China;
Yongkang Zhang, Southeast University, Nanjing, China
Concerned Technical Topics may include, but are not limited to:
Green and Sustainable Manufacturing based on Lasers
Hybrid Laser / Non-laser Processing
Laser Cutting and Drilling
Laser Joining (Welding, Soldering, Brazing)
Laser Processing of Light Weight Metals
Laser Rapid Prototyping, Forming & Additive Manufacturing
Laser Surface Conditioning (Cleaning, Polishing, Hardening and Peening)
Laser Surface Coating (Alloying, Cladding, Deposition)
Laser Synthesis of Novel Materials (Novel Microstructure and Novel Properties)
Novel Processing Technologies & Applications
Process Simulation & Modeling
Symposium 3：Laser Micro/Nano Fabrication Science and Techniques Symposium
Co-Chairs:
Yongfeng Lu, University of Nebraska - Lincoln
Hongbo Sun，Jilin University
Concerned Technical Topics may include, but are not limited to:
Laser Applications in Nanophotonics, Nanoelectronics & Microelectronics
Laser-assisted Packaging,
Laser Lithography,
Lasers Machining of Photonic Components,
Medical Device Fabrication,
MEMS & MOEMS,
Fabrication & Lasers in Microsystems,
Micro/ nano Processing by Lasers & Laser/ other Tool,
Hybrid Methods, Process Control & Process Modeling,
Ultrafast (Picosecond & Femtosecond) & UV Fabrication