ESREF 2011 - 2011 22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - ESREF 2011

The conference will concentrate on two main areas of interest in electronics concerning designers, manufacturers and users:

Strategy for Quality and Reliability Assessment during Product Development and Life Cycle
Advanced Analysis Techniques for Technologies and Product Evaluation
The Technical Programme Committee selected original papers that address one or more of the following topics :

Quality and Reliability assessment techniques and methods for Devices and Systems
Design for reliability, Built-in reliability,
Virtual qualification, Reliability simulation,
Advanced models for Reliability prediction,
Extreme environments,
Advanced models for Reliability prediction,
Reliability test structures, Limits to accelerated tests,
Screening methods, Yield/reliability relationship.
Physical Modeling and Simulation for Reliability Prediction
Characterization of defects, Defect models,
Numerical simulation,
Simulation of reliability in integrated circuits.
Advanced Failure Analysis: Defect Detection and Analysis
Electron, ion and optical beam techniques,
Scanning probe techniques,
Static or dynamic techniques, Backside techniques,
Acoustic microscopy,
Electric or magnetic field based techniques
Electrical, thermal and thermo-mechanical characterization,
Sample preparation, construction analysis,
Failure analysis: case studies.
Failure Mechanisms in New Materials and Transistors
Process-related issues, Passivation stability,
Hot carriers injection, NBTI, TDDB
High-K dielectrics and gate stacks,
Low-K dielectrics and Cu interconnects,
ESD-EOS
Metal migration: mechanical and thermal aspects,
Radiation impact on circuits and systems reliability.
Failure analysis and Reliability of Advanced and Nanoscale electronics
Non-volatile and programmable cells,
Silicon on Insulator devices.
Wide bandgap semiconductors,
Microwave and compound semiconductor devices,
Photonic devices: Optoelectronics, lasers and solar cells,
Optical and NTC Interconnects,
MEMS and MOEMS,
NEMS and nano-objects.
Power Devices Reliability
Smart-power devices, IGBT, thyristors,
High voltage devices,
Thermal management.
Packaging and Assembly Reliability
Failure mechanisms and environmental constraints,
MCM, CSP, BGA, SiP, WLP, QFN, advanced PCB,
Bonding, solders and joints, Connectors,
Passive elements.
For further information concerning the scientific programme, please contact:

Nathalie LABAT

esref2011-AT-ims-bordeaux.fr