GIT 2011 - 2011 Global Interposer Technology Workshop (GIT)

The GIT Workshop is intended to compare and contrast the wide variety of interposer approaches being developed as well as promote and disseminate revolutionary and evolutionary advances in emerging silicon, glass and other interposer technologies, by bringing together academic and industry researchers, technology developers, users and manufacturers from around the world. Such a technology is seen as not only for packaging of ICs and 3D ICs but also act as a better alternative to 3D ICs with TSV, and eventually providing a path for entire systems.
The first of its kind, the GIT Workshop will bring together industry experts, global academic researchers, and student leaders to share leading-edge interposer technology research, development, applications, markets and manufacturing infrastructure. It is a must-attend event for those highly interested in interposer technology advances for the future.
Technical Sessions on Interposer Technology will feature technical leaders in the following topics:
1. Electrical Design
2. Mechanical Design
3. Silicon Interposers
4. Glass Interposers
5. Chip Level Interconnections
6. Board Level Interconnections
7. Applications and Markets
8. Manufacturing Infrastructure