SIITME 2011 - 2011 IEEE 17th International Symposium for Design and Technology in Electronic Packaging (SIITME)

The organizing committee of SIITME 2011 kindly invites you to submit a paper/abstract to 17th International Symposium for Design and Technology in Electronic Packaging.
The scientific event shall take place in Timisoara, a beautiful town located in the Western Romania, close to the Hungarian border, on October 20th ? 23th, 2011.
SUBMISSION OF ABSTRACTS:
Interested authors are invited to submit a two-page abstract according to the template, as MS-Word document, Version 97 or later, and as PDF document.
Presented papers will be included in the IEEE Xplore Digital Library
Please note: electronic submission only. Submit the abstracts to:
http://www.siitme.ro/submission
TOPICS:
1. Emerging Technologies & Trends in Advanced Packaging
Fine pitch and high lead count packaging in CSP, BGA, CGA, LGA or SMT packages
Advanced packaging involving new materials
Improved thermal management and new design, environmental protecting packaging
Innovative interconnects applied tadvanced packaging
Organic printable electronics packaging
Green electronic packaging
2. Power Electronics and Microsystems Packaging
Alternative packaging and cooling concepts (e.g. double-sided cooling)
Thermal and thermo-mechanical performance of power packages and modules
Reliability investigations and life time prediction
High power and high temperature applications
New approach of sensor and actuator principles
Integration of new functionality in microsystems
Application and product-oriented packaging technologies: RF, MEMS and power packaging
Micro-nanintegration
3. Assembly and Manufacturing Technology
Advanced process development and equipment improvement for volume production
Cost, yield, performance and environmental impact improvements
Process characterization
New product introduction and ramp-up
Design for flexible manufacturing, testing and burn-in, and design for manufacturing
Manufacturing simulation, optimization and scheduling
MEMS and optoelectronic assembly
Board level, product and system level assembly
4. Electrical Design, Simulation & Modeling
Technology-aware design of circuits and systems: from architectural design timplementation level
Multi domain system level modeling
Electrical, mechanical and thermal simulation and modeling
Prediction of thermal and mechanical performance of packages and modules
Simulation and characterization of packaging solutions including system-level applications
CAD ? CAM Systems
Design for manufacturability and testability
Impact of integration technology ? SiP and 3D
5. Optoelectronics & Advanced Communication Packaging
Power LED and solid state lighting
Optical communications
Optical PCB: optical and electrical signal integration
Hi-power diode laser packaging, couplings, fiber pigtailing and connectorization
Concentrating photovoltaics (CPV) and optoelectronics in energy
Wireless communications
RFID technology, tags and readers
Software Design Radio
6. Applied Reliability
Fast reliability qualification, reliability standards
Advanced failure analysis, failure prediction and experimental verification
Reliability modeling, reliability diagnostics and curing
Reliability field data analysis
Characterization and modeling of the behavior materials, processes and products
Lifetime prediction
7. Challenge in Global Education
Industry requirements for skills and competencies needed of graduating engineers ? now, and looking forward 5-10 years.
The impact of globalization on engineering practice and engineering education.
The impact of progress in computing and networking on practice and education in engineering.
The role of technology transfer and commercialization of research in Engineering Education.
Teaching non-technical skills tengineers: interpersonal, written and oral communications; cross-cultural awareness; language skills; entrepreneurship; environmental and ethical concerns; leadership; legal and regulatory requirements; managing intellectual property.
Strategies for introducing and sustaining curricular reform in engineering.
Strategies for introducing and sustaining cross-disciplinary academic programs.
Providing graduating engineers with lifelong learning.
CHAIRS:
General Chair
Paul SVASTA, “Politehnica” University of Bucharest, Romania
General Co Chair
Dan PITICĂ, Technical University of Cluj-Napoca, Romania
Conference Chair
Aurel-Stefan GONTEAN, “Politehnica” University of Timişoara, Romania
Program Chair
Ioan ILEANA, “1 Decembrie” University of Alba Iulia, Romania
Scientific Chairs
Vlad CEHAN, “Gheorghe Asachi” Technical University of Iaşi, Romania
Heinz WOHLRABE, Technical University of Dresden , Germany
Publication Chair
Zsolt ILLYEFALVI-VITEZ, Budapest University of Technology and Economics, Hungary

Web page: http://www.siitme.ro