AI 2019 - Embedded AI Summit 2019

Embedded AI Summit 2019 (https://www.embedded-ai.org/index.html) will be held at Shenzhen, from Dec. 6 to Dec. 8. Embedded AI is the fusion of the Internet of Things and AI, moving AI capabilities from the Cloud to the device and edge. The 2019 Embedded Intelligence International Conference will be held in Shenzhen from December 6th to 8th to showcase the future of embedded AI, including key technologies and applications such as computer vision, 3D vision, medical image processing, speech recognition, NLP, sensor fusion, and autonomous driving. The conference will bring together the most influential scientists, entrepreneurs and thinkers of embedded intelligence around the world to discuss the technological frontiers, industry trends and practices in the field. Dozens of international leading companies specializing in chips, modules, tools and applications will showcase their latest products.
The conference calls for posters on cutting-edge research related to embedded artificial intelligence from both academia and industry. The authors should submit a 2-page English abstract at the submission website. At least one author of each accepted poster abstract needs to register and attend the meeting. The conference will select the best poster award. Topics of interest include, but are not limited to:
Embedded AI for the sensor, UAV, and robotic systems
AI algorithms for IoT systems
Network and system architectures and protocols for embedded AI applications
Embedded algorithms and systems for computer vision, speech recognition, and machine learning
Programming models and languages for embedded AI systems
Modeling, simulation, and measurement tools for AI applications
Operating systems and runtime environments for embedded AI
Applications of embedded AI in health, transportation, smart city, and manufacturing
Experiences, challenges, comparisons of embedded AI platforms
Security and privacy of embedded systems
Submission website: https://www.embedded-ai.org/submission.html
TPC Co-Chairs
Guoliang Xing: Professor, The Chinese University of Hong Kong
Hua Li: Associate Professor, Beihang University
Important Dates
Submission Deadline：Oct. 20, 2019
Notification: Oct. 27, 2019
Conference：December 6-8, 2019
Keynote Speakers
Marilyn Wolf: Chair, Dept. of Electrical and Computer Engineering, University of Nebraska, Lincoln, IEEE Fellow, ACM Fellow
Jeff Bier: Founder of Embedded Vision Alliance
Edward A. Lee: Distinguished Professor, Electrical Engineering and Computer Sciences, UC Berkeley, Ex-Chair of EECS Department, IEEE Fellow
Wei Zhao: Former Rector at the University of Macau, American University of Sharjah, Vice Principal of Scientific Research, IEEE Fellow
Tei-Wei Kuo: Dean of College of Engineering, Chair Professor of Information Engineering City University of Hong Kong, IEEE Fellow, ACM Fellow
Feng Zhao: CTO, Vice President of Haier Electrical Appliance Industry Group, IEEE Fellow
Jieping Ye: Vice President of Didi Research Institute, IEEE Fellow
Yiran Chen: Professor, Electrical and Computer Engineering, Duke University, IEEE Fellow
Prabal Dutta: Associate Professor, Electrical Engineering and Computer Sciences, UC Berkeley, Sloan Research Fellow, Anthony Rowe: Professor, Electrical and Computer Engineering, Carnegie Mellon University
Nick Zhang: President, Wuzhen Institute, Author of “A Brief History of AI”（2018）
Pei Zhang: Associate Professor, Electrical and Computer Engineering, Carnegie Mellon University