THERMINIC 2011 - 2011 17th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of circuits packaged together and with the move to nanotechnology. These trends are calling for thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system’s cost. The growing power dissipated in a package, the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system.
This year THERMINIC will address in addition to the "traditional" thermal management problems, also stress and thermal-stress-related-reliability issues, both in micro- and opto-electronics fields. These issues, including various nanotechnology applications, are of significant importance and of high interest to the engineering community engaged in the field of thermal phenomena in "high-tech" systems.
The Workshop is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP.

AREAS OF INTEREST include, but are not limited to, the following topics:

Thermal and Temperature Sensors

Measurement of Thermal Properties

Thermal Simulation

Acquisition and analysis of Thermal data

Electro-thermal Simulation

Temperature Mapping

Thermal Modelling Investigation of Packages

Novel and Advanced Cooling Techniques

Reliability Issues

Thermal Performance of Interconnects

High Temperature Electronics

Heat Transfer Enhancement

Heat Transfer Education

Validation of Thermal Software

Flow Visualisation Techniques

Coupled Thermo-mechanical, Thermo- optical, etc.) Effects

Turbulence Modelling in Complex Geometrics

Thermal Stress: Theory and Experiment

Defect and failure modelling

Thermal Stress Failures: Prediction and Prevention

Reliability evolution and prediction

Nanotechnology Applications

Multiphysics simulation

Noice control

Nanoengineering issues

3DIC, power electronics

Education