CMA 2019 - 2019 International Conference on Metals and Alloys
Date2019-08-19 - 2019-08-22
Deadline2019-08-12
VenueBeijing, China
KeywordsMetals; Alloys
Websitehttps://www.cmaconf.org
Topics/Call fo Papers
2019 International Conference on Metals and Alloys will be held from August 19 to 22 in Beijing, China, which is sponsored by Ghent University, Nanjing Tech University, Ton Duc Thang University and Duy Tan University. The overall objective of the conference is to bring together international scientists and engineers in academia and industry in fields related to research in metals and alloys.
★ Publication and Indexing
All accepted and registered papers will be included in IOP Conference Series: Materials Science and Engineering,which will be indexed by EI Compendex, Scopus, etc.
★ Topics of interest for submission include, but are not limited to:
Mechanical Behaviour:
Wear
Creep
Dislocation
Hardness
Material Properties
Fatigue and Fracture
Mechanical Strength
Damage Initiation
Crack Propagation
Mechanical Testing
Metallurgy and Microstructures:
Thin Films
Microstructure
Nanostructures
Production Metallurgy
Metal Working
Powder Metallurgy
Metal Composites
Welding and Joining
Modeling and Validation
More topics can be found at http://www.cmaconf.org/Topics.html
★ Paper Submission
1. Submit original technical papers via Submission System
2. Submit original technical papers via Submission System via email cma-AT-cmaconf.org
★ Call for participants
1. Presenter:If you are interested in presenting your research on the conference, without publishing your paper in the proceeding, you only need to submit the abstract to us!
2. Listener:If you are interested in attending the conference to understand ongoing research achievements and share with them your ideas, you are welcome to send your name and affiliation to us.
★ Conference Highlights
1. Invited Speakers will have a longer presentation time and we will post your information on the website so that other participants can learn more from you first. If you are interested, please do not hesitate to let us know;
2. Conference proceeding will be indexed by Scopus, Engineering Compendex (EI), Inspec and etc;
3. Best Oral Presenters will be awarded a free registration for the next conference;
5. Lunches and Dinners during August 19-22 are covered;
6. One day tourism will be provided.
★ Contact us
Ms. Bernice Wu-Conference Secretary
E-mail: cma-AT-cmaconf.org
Tel.&Wechat: +86-13545231968
LinkedIn: www.linkedin.com/in/cmanme-conference
★ Co-located conference:
2nd International Conference on Numerical Modelling in Engineering
(http://www.nmeconf.org/index.html)
★ Publication and Indexing
All accepted and registered papers will be included in IOP Conference Series: Materials Science and Engineering,which will be indexed by EI Compendex, Scopus, etc.
★ Topics of interest for submission include, but are not limited to:
Mechanical Behaviour:
Wear
Creep
Dislocation
Hardness
Material Properties
Fatigue and Fracture
Mechanical Strength
Damage Initiation
Crack Propagation
Mechanical Testing
Metallurgy and Microstructures:
Thin Films
Microstructure
Nanostructures
Production Metallurgy
Metal Working
Powder Metallurgy
Metal Composites
Welding and Joining
Modeling and Validation
More topics can be found at http://www.cmaconf.org/Topics.html
★ Paper Submission
1. Submit original technical papers via Submission System
2. Submit original technical papers via Submission System via email cma-AT-cmaconf.org
★ Call for participants
1. Presenter:If you are interested in presenting your research on the conference, without publishing your paper in the proceeding, you only need to submit the abstract to us!
2. Listener:If you are interested in attending the conference to understand ongoing research achievements and share with them your ideas, you are welcome to send your name and affiliation to us.
★ Conference Highlights
1. Invited Speakers will have a longer presentation time and we will post your information on the website so that other participants can learn more from you first. If you are interested, please do not hesitate to let us know;
2. Conference proceeding will be indexed by Scopus, Engineering Compendex (EI), Inspec and etc;
3. Best Oral Presenters will be awarded a free registration for the next conference;
5. Lunches and Dinners during August 19-22 are covered;
6. One day tourism will be provided.
★ Contact us
Ms. Bernice Wu-Conference Secretary
E-mail: cma-AT-cmaconf.org
Tel.&Wechat: +86-13545231968
LinkedIn: www.linkedin.com/in/cmanme-conference
★ Co-located conference:
2nd International Conference on Numerical Modelling in Engineering
(http://www.nmeconf.org/index.html)
Other CFPs
- ISER- 526th International Conference on Physical Education and Sport Science (ICPESS)
- ISER- 526th International Conference on Science, Health and Medicine (ICSHM)
- ISER - 525th International Conference on Science, Technology, Engineering and Management (ICSTEM)
- ISER - 478th International Conference on Heat Transfer and Fluid Flow (ICHTFF)
- ISER-524th International Conference on Nanoscience, Nanotechnology & Advanced Materials (IC2NAM)
Last modified: 2019-01-04 19:03:40