COMCAS 2009 - 2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (IEEE COMCAS 2009)

COMCAS 2009 continues the tradition of providing a multidisciplinary forum for the exchange of ideas in the areas of microwaves, antennas, communications, solid state integrated circuits, sensing and electronic systems engineering. The venue will be exciting and enjoyable with many opportunities for networking, candid exchange of ideas and a strong sense of community. This year we will expand the program to include RF and microwave photonics, biomedical technologies, cognitive radios and networks, radar, radio frequency identification, electron devices and photonic means for IC inspection among other topics. A diverse assembly of researchers, engineers and scientists will be invited to present their ideas and discuss new results, providing a unique opportunity for attendees to view a variety of interesting and innovative technologies in one location. Invited papers and tutorial talks from international experts will be presented in key topical areas. So please join us for the 2nd Annual IEEE COMCAS meeting in the exciting and vibrant city of Tel Aviv, Israel from 9-11 November 2009.
Technical Topics:
• Ad Hoc, Sensor and Mesh Networking
• Antennas (components, modeling, phased array, etc.)
• Biomedical Technologies
• Cognitive and Software-Defined Radios and Networks
• Communications Systems, Modeling, Simulation and Analysis
• Computational Electromagnetics and Wave Propagation
• Electromagnetic Compatibility
• Energy Harvesting and Thermal Management
• Hyperspectral Imaging and Remote Sensing
• MEMS (Modeling, Devices, Applications)
• Mixed Signal Analog/RF/Digital Circuits and Systems
• Microwave and MM-wave circuit technologies
• Nanoplasmonics and Metamaterials
• RF/Microwave Photonics
• Power Amplifiers and Electron Devices
• Radar and Electronic Systems
• RFID Devices, Technologies and Systems
• Solid State Devices, RFICs, Circuits and Modeling
• Terahertz Technology & Applications

Regular oral presentations will be 20 min. in length; there will also be Poster sessions.
All submitted papers will be peer reviewed and assessed on key accomplishments, contribution to technology, advancement of the state-of-the-art, originality and interest to the attendees. Accepted papers will be published in the COMCAS 2009 Proceedings which will be available through IEEE Xplore after the conference.
Papers should first be submitted as a 1 to 2 page summary. Please refer to the detailed author instructions provided on the conference web site www.comcas.org.

The official language of the Conference is English.
Deadline for Summary Submission: 15 June 2009. Final manuscripts due 15 Sept. 2009
The technical program will be complemented with a Technical Exhibition, which will be held on November 9-10, offering companies and agencies a unique opportunity to visit Israel and present related products and services in display and printed advertisement.