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TEMC 2019 - The First International Workshop on Theoretical and Experimental Material Computing

Date2019-06-03 - 2019-06-07


VenueTokyo, Japan Japan



Topics/Call fo Papers

Material computing exploits unconventional physical substrates and/or unconventional computational models to perform physical computation in a non-silicon and/or non-Turing paradigm.
TEMC 2019 will encompass a range of theoretical and experimental approaches to material computing. The aim of the workshop is to bring together researchers from a range of connected fields, to inform of latest findings, to engage across the disciplines, to transfer discoveries and concepts from one field to another, and to inspire new collaborations and new ideas.

Last modified: 2019-01-01 23:17:36