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StICT 2019 - 2019 IEEE Sustainability through ICT Summit (StICT)

Date2019-06-18 - 2019-06-20

Deadline2019-01-15

VenueMontréal, QC, Canada Canada

Keywords

Websitehttp://sustainableict.ieee.org/summit/si...

Topics/Call fo Papers

In an increasingly connected world, where Information and Communication Technology (ICT) is transforming all spheres of human activity, both opportunities and challenges for sustainability are arising from the widespread use of ICT. ICT can be leveraged for sustainability’s triple bottom line of economic, environmental and social benefits by facilitating green business models and societal functions. However greening ICT through energy efficient operation and resource management as well as the use of renewable energy sources and proper life cycle management is indispensable to unleash the full potential of greening through ICT and more generally of ICT as a driving force of sustainability.
The 2019 IEEE Sustainability through ICT Summit (StICT), in its second edition, will be held on 18-20 June 2019 at the ETS campus in Montréal. Under the theme of “ICT - A Key Driver for Sustainability,” the Summit promotes a holistic approach on prospects for technologies, standards and policies for ICT-enabled sustainable development that also takes into consideration the sustainability of ICT resources. The summit is sponsored by the IEEE Sustainable ICT Initiative.
Professionals from different disciplines are invited to contribute to the open dialogue over the 3-day summit. The summit will provide an inter-discipline collaboration platform for ICT practitioners; users; technology providers; the standardization community; policy makers; and the research community to exchange views and share expertise through the “Sustainability through ICT” keynote speeches and discussion panel session on Day 1 and the World Cafe event on Day 2. On Day 3, the summit will host the International Workshop on Green ICT and Smart Networking (GISN 2019) where researchers from both industry and academia will come together to promote discussions on smart and green solutions for stimulating, innovating, designing, provisioning, and optimizing the networked society.
IEEE Sustainable ICT initiative White Paper “A Smart and Sustainable World through ICT”
represents output from the first Summit and sets the stage for the World Café Event (Day 2)
of this Summit. The white paper will be available shortly.
The summit invites submissions on different aspects of networking and computing with a strong focus on sustainability of ICT and sustainability through ICT.
Papers will be dispatched for either Day 1 (Sustainability through ICT) or Day 3 GISN Workshop (Greening ICT). The World Café on Day 2 will be a fully interactive session between all participants to address challenges and opportunities to achieve sustainability through ICT.
Topics of interest include but are not limited to:
• Green data center architectures
• Energy efficient resource provisioning in data centers
• Green cloud and fog computing
• Green 5G and Beyond 5G systems
• Sustainable smart networking technologies
• Sustainable ICT equipment design
• QoE/QoS trade-offs in sustainable ICT
• Modelling of sustainable ICT systems
• The use of Renewable energy in ICT
• Community resilience microgrids
• Life-cycle analysis for smart ICT
• E-waste
• Circular economy and large scale sensing systems
• Standardization of Green ICT
• ICT for sustainable industrial applications
• ICT for sustainable buildings
• Sustainability applications for smart cities
• Sustainable smart transportation
• Sobriety in software design
• Communication technologies for energy harvesting
• Machine learning for sustainable systems
• Business models and public policy (regulatory) options for sustainability through ICT
Important Dates:
Paper Submission: January 15th, 2019
Notification of acceptance: February 28th, 2019
Camera Ready: March 28th, 2019
How to Submit:
• All papers must be submitted in PDF and US letter format. Submitted papers must conform to the IEEE formatting guidelines as specified in these Word and LaTeX templates. The submission must clearly identify the specific Vertical or topical area it is related to.
• Papers are limited to six (6) pages, without incurring extra page charges. Papers may be extended to eight (8) pages however, for a paper longer than 6 pages, an extra page charge per additional page will be applied.
• All submitted technical papers will be peer reviewed by an international Technical Program Committee (TPC). If the paper is accepted, registered and presented, it will be included in the conference proceedings and be submitted to the IEEEXplore Digital Library. IEEE takes the protection of intellectual property very seriously. All submissions will be screened for plagiarism using CrossCheck. All submitted papers are subject to the IEEE ComSoc plagiarism policy, see: https://www.comsoc.org/conferences/plagiarism-poli...
• Papers must be marked and submitted electronically:
https://edas.info/N25451
o If you do not already have an EDAS account, you need to create one as the first step in the submission process.
o Once you create an account and login, scroll down to the row:
StICT 2019 2019 IEEE Sustainability through ICT Summit (StICT)
o Then, click on the link ' 2019 IEEE Sustainability through ICT Summit (StICT)' and follow the directions to submit your paper.
Contacts:
Honorary Chairs (IEEE Sustainable ICT Initiative Co-Chairs)
 Prof. Jaafar Elmirghani, School of Electronic and Electrical Engineering, Univ. of Leeds, UK, J.M.H.Elmirghani-AT-leeds.ac.uk
 Prof. Charles Despins, École de Technologie Supérieure, Univ. of Québec, Canada, Charles.Despins-AT-etsmtl.ca
Summit General Co-chairs
 Dr. Emad Alsusa, School of Electrical and Electronic Engineering, Manchester Univ., UK, e.alsusa-AT-manchester.ac.uk
 Dr. Taisir El-Gorashi, School of Electronic and Electrical Engineering, Univ. of Leeds, UK, t.e.h.elgorashi-AT-leeds.ac.uk
Summit TPC Chair
 Dr. Burak Kantarci, School of Electrical Engineering and Computer Science, Univ. of Ottawa, Canada, burak.kantarci-AT-uottawa.ca
Local Arrangements Chair
 Prof. Mohamed Cheriet, École de Technologie Supérieure, Univ. of Québec, Canada, mohamed.cheriet-AT-etsmtl.ca
GISN General Co-Chairs
 Prof. Mohamed Cheriet, École de Technologie Supérieure, Univ. of Québec, Canada, mohamed.cheriet-AT-etsmtl.ca
 Prof. Tereza Cristina Melo de Brito Carvalho, Polytechnic School, Univ. of Sao Paulo, Brazil
GISN TPC Co-Chairs
 Dr. Kim-Khoa Nguyen, École de Technologie Supérieure, Univ. of Québec, Canada, kim-khoa.nguyen-AT-etsmtl.ca
 Dr. Ana Carolina Riekstin, École de Technologie Supérieure, Univ. of Québec, Canada, ana-carolina.riekstin.1-AT-ens.etsmtl.ca
 Dr. Mohamed Musa, School of Electronic and Electrical Engineering, Univ. of Leeds, m.musa-AT-leeds.ac.uk
 Prof. Dan Kilper, University of Arizona, AZ, USA, dkilper-AT-optics.arizona.edu
Please visit the 2019 IEEE Sustainability through ICT Summit (StICT) website for more information: http://sustainableict.ieee.org/summit/sict-summit-... .

Last modified: 2018-12-28 22:38:46