TSP 2019 - 2019 42nd International Conference on Telecommunications and Signal Processing (TSP)

2019 42nd International Conference on Telecommunications and Signal Processing (TSP - http://tsp.vutbr.cz/), which will be held on July 3-5, 2019, in Budapest, Hungary.
The TSP Conference serves as a premier annual international forum to promote the exchange of the latest advances in telecommunication technology and signal processing. The aim of the Conference is to bring together both novice and experienced scientists, developers, and specialists, to meet new colleagues, collect new ideas, and establish new cooperation between research groups from universities, research centers, and private sectors from the whole Europe, America, Asia, Australia, and Africa.
TOPICS:
TSP 2019 has opened Call for Workshop and Special Session Proposals (deadline set for February 1, 2019) and Call for Regular Full Paper Submissions with a deadline February 15, 2019. We look forward to your innovative contributions in any of the following areas:
AREA 1: Telecommunications
1. Information Systems
2. Network Services
3. Network Technologies
4. Telecommunication Systems
5. Modelling, Simulation and Measurement
AREA 2: Signal Processing
6. Analog Signal Processing
7. Audio, Speech and Language Processing
8. Biomedical Signal Processing
9. Digital Signal Processing
10. Image and Video Signal Processing
For more details please visit the Conference website at http://tsp.vutbr.cz/?page_id=121 .
WORKSHOPS AND SPECIAL SESSIONS:
Prospective Organizers are invited to submit proposals for Workshops and Special Sessions held during the TSP 2019 Conference. Organizing guidelines are available at http://tsp.vutbr.cz/?page_id=3492 .
The following Special Session was approved so far:
- SS1: Special Session on Internet of Things Communication Networks by Dr. Jorge Crichigno (University of South Carolina, U.S.A.) and Dr. Gautam Srivastava (Brandon University, Canada)
STUDENT BEST PAPER AWARD:
In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced by the quality of papers, their presentations, and their technical excellence, the authors of the Best 5 Student Papers will be awarded during the conference by the Technical Committee. The Best Student Paper Award consists in a Plaque and a Certificate of Appreciation.
ORGANIZERS:
The TSP 2019 is IEEE technically co-sponsored Conference organized in cooperation with seventeen universities:
- Brno University of Technology, Department of Telecommunications, Brno, Czech Republic
- Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary
- Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic
- Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey
- Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey
- Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey
- National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan
- Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan
- Slovak University of Technology, Institute of Telecommunications, Bratislava, Slovak Republic
- Tecnocampus, Escola Universitaria Politecnica de Mataro, Mataro, Spain
- Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria
- Universite Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancee de Saint-Denis (LIASD), France
- University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia
- University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Osijek, Croatia
- University of Patras, Physics Department, Patras, Greece
- VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic
- West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, Poland
COMMITTEES:
- Miloslav Filka, Brno University of Technology, Czech Republic – Full Professor, TSP Conference Founder - Honorary Chair
- Norbert Herencsar, Brno University of Technology, Czech Republic – IEEE Czechoslovakia Section CAS/COM/SP Joint Chapter Chair, IEEE Senior Member - General Co-Chair
- Attila Vidacs, Budapest University of Technology and Economics, Hungary – Deputy Head of Department - General Co-Chair
- Jiri Hosek, Brno University of Technology, Czech Republic – IEEE Member - Student Paper Contest Chair
- Aslihan Kartci, Brno University of Technology, Czech Republic – IEEE Graduate Student Member - Publicity & Social Media Chair
- Nandor Matrai, Asszisztencia Congress Bureau, Hungary – Finance Chair
- Csilla Fulop, Asszisztencia Congress Bureau, Hungary – Registrations Chair
Steering Committee:
- Larbi Boubchir, Universite Paris 8, France – Associate Professor, IEEE Senior Member
- Marcos Faundez-Zanuy, Escola Universitària Politecnica de Mataro, Tecnocampus, Spain – Full Professor, Dean
- Izzet Cem Goknar, Isik University, Turkey – Institute of Science Director & Circuits and Systems (CAS) Society Turkey Chapter Chair, Full Professor, IEEE Life Fellow
- Ray-Guang Cheng, National Taiwan University of Science and Technology (NTUST), Taiwan – Full Professor, IEEE Senior Member
- Ismail Kaya, Karadeniz Technical University, Turkey – Full Professor
- Jaroslav Koton, Brno University of Technology, Czech Republic – Vice-dean for Research, IEEE Senior Member
- Sridhar Krishnan, Ryerson University, Canada – Full Professor & Associate Dean, IEEE Senior Member
- Mario Kusek, University of Zagreb, Croatia – IEEE Croatia Section Communications Chapter Chair, IEEE Member
- Antonio Luque, University of Seville, Spain – IEEE Region 8 Vice Chair Member Activities 2017, IEEE Spain Section Chair 2016-2017, IEEE Senior Member
- Shahram Minaei, Dogus University, Turkey – Full Professor, IEEE Senior Member
- Jiri Misurec, Brno University of Technology, Czech Republic – Full Professor, Department Chair
- Ram M. Narayanan, The Pennsylvania State University, USA – Full Professor, IEEE Fellow
- Kimio Oguchi, Seikei University, Japan – Full Professor, IEEE Senior Member
- Serdar Ozoguz, Istanbul Technical University, Turkey – Full Professor, Associate Chair
- Jakub Peksinski, West Pomeranian University of Technology, Poland
- Hector Perez-Meana, National Polytechnic Institute, Mexico – Full Professor, IEEE Senior Member
- Vladimir Poulkov, Technical University of Sofia, Bulgaria – Full Professor, Dean, IEEE Senior Member
- Costas Psychalinos, University of Patras, Greece – Full Professor, IEEE Senior Member
- Markus Rupp, Vienna University of Technology, Austria – Full Professor, Dean, IEEE Fellow
- Zdenek Smekal, Brno University of Technology, Czech Republic – Full Professor, IEEE Senior Member
- Attila Vidacs, Budapest University of Technology and Economics, Hungary – Deputy Head of Department
- Miroslav Voznak, VSB-Technical University of Ostrava, Czech Republic – Full Professor, Department Chair, IEEE Senior Member
- Drago Zagar, Josip Juraj Strossmayer University of Osijek, Croatia – Full Professor, Dean, IEEE Senior Member
IMPORTANT DATES:
Workshop and Special Session Proposals: February 1, 2019
Full Paper Submission: February 15, 2019
Notification of Paper Acceptance: April 15, 2019
Final Paper Submission: April 30, 2019
Authors' Early Registration and Payment: May 10, 2019
Authors' Late Registration and Payment: May 20, 2019
Listeners' Registration: July 3, 2019
Conference: July 3-5, 2019
CONTACTS:
For more information please visit the Conference website at http://tsp.vutbr.cz/. We are also ready to answer your questions emailed to tsp-AT-feec.vutbr.cz .