ICBC 2019 - 2019 IEEE International Conference on Blockchain and Cryptocurrency

2019 IEEE International ConferenceBC 2019) will be held in beautiful and vibrant
Seoul, Korea, May 15-17, 2019. ICBC 2019 is the first IEEE Communications
Society (ComSoc) sponsored conference on Blockchain and Cryptocurrency.
It will feature keynotes, tutorials, technical paper presentations, posters,
demos, and exhibitions from world-leading service providers, solution vendors,
research institutes, open source projects, and academia. ICBC 2019 will be
the primary forum for technical exchange of the latest research and innovation,
regulations, policies, standards, and applications in this exciting and challenging
area.
ICBC 2019 is seeking submissions of technical papers (both full and short)
and tutorial proposals in the following areas related to Blockchains and
Cryptocurrencies:
Distributed Consensus & Fault Tolerance Algorithms
Performance, Scalability Issues
Distributed Database Technologies for Blockchain
Blockchain Platforms
Blockchain-based Applications & Services
Decentralized App Development
Smart Contracts
Security, Privacy, Attacks, Forensics
Transaction Monitoring and Analysis
Token Economy
Regulations & Policies in Cryptocurrency
Digital Wallets, Coin Exchange, Initial Coin Offering
Anonymity and Criminal Activities of the Cryptocurrency
Managing the Risks of Cryptocurrency
Distributed Trust
Decentralized Internet Infrastructure
SUBMISSION INSTRUCTIONS
Authors are invited to submit 8 pages for full papers, 4 pages for short papers, or 2 pages for poster papers (all excluding references).
The paper submission templates are available on IEEE Manuscript Templates for Conference Proceedings. All submitted papers will
be peer-reviewed. Accepted and presented papers will be published in the conference proceedings and submitted to IEEE Xplore.
All papers should be submitted through the JEMS conference submission system.
IMPORTANT DATES
Paper submission deadline: Dec. 7, 2018
Acceptance Notification: Feb. 11, 2019
Camera-Ready due: Mar. 18, 2019
Conference Dates: May 15-17, 2019
GENERAL CHAIR
JamesWon-Ki Hong, POSTECH, Korea
TPC CO-CHAIRS
RaoufBoutaba, University of Waterloo, Canada
BurkhardStiller, University of Zurich, Switzerland
HongtaekJu, KMU, Korea