EuroSimE 2012 - 2012 13th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems. This includes, but is not limited to:
mechanical simulation (both static and dynamic),
thermo-mechanical simulation,
thermal simulation,
material characterisation experiments and modelling,
thin-film mechanics,
failure criteria and damage-modelling (fatigue, creep, delamination, cracks, buckling, large deformation, moisture-induced failures, yield),
fracture, continuum, and micro-mechanics in (micro)-electronics,
interface strengths,
experiments for model verification,
simulation in reliability engineering,
(micro)-electronic product and/or process optimisation,
simulation-based optimisation,
simulation for reliability improvement/failure prediction,
virtual and accelerated reliability qualification,
design rule development via simulation,
virtual prototyping in product and/or process design,
from micro to macro simulation,
multi-physics simulation,
advanced numerical and analytical simulation methodologies and tools.