WiAd 2011 - 2011 Wireless Advanced (WiAd) (Formerly known as SPWC)

Wireless Advanced (formerly known as SPWC) is the premier wireless communication event hosting speeches from some of the most prominent researchers in academia and industry. The 6th IEEE co-sponsored conference SPWC (now known as Wireless Advanced) will be hosted by Center for Telecommunication Research of King’s College London between 27th-29th June 2011. The Venue is Strand Campus of King’s College London.

This conference has received technical co-sponsorship from the IEEE UKRI Communications Chapter and IEEE UKRI Information Theory Society and the proceedings will be archived in the IEEE Xplore.

Paper submissions are invited in the following areas:
- Cross-layer Methods in Wireless Communications
- Ad Hoc, Sensor and Mesh Wireless Networking
- Wireless Communication Theory
- Multimedia Applications in Wireless Networks
- Quality of Service, Reliability, and Performance Modelling
- Security in Wireless Networks
- Next Generation Networks, Protocols, and Services
- Signal Processing for Wireless Communications

Papers should be in English, not exceeding six double-column pages. Authors should use the relevant IEEE template, ensuring an IEEExplore-compatible PDF format.
Download call for paper

Important Dates:
Paper submission deadline: 29th April 2011
Registration deadline: 27th May 2011
Acceptance notification: 1st June 2011
Final manuscript due: 8th June 2011

Previous Speakers:
F. Adachi, Tohoku University, Japan, A. Bahai, National Semiconductor, USA, C. Berrou, Technopôle Brest Iroise, France, E. Biglieri, Politecnico Di Torino, Italy, A. Burr, University of York, UK, G. Caire, University of Southern California, USA, G. Charbit, Nokia, UK, A. Goldsmith, Stanford University, USA, L. Hanzo, Southampton University, UK, B. Honary, Lancaster University, UK, H. Imai, University of Tokyo, Japan, R. Kohno, Yokohama National University, Japan, Y. Nuevo, Nokia, Finland, A. Paulraj, Stanford University, USA, V. Poor, Princeton University, USA, S. Shamai, Technion Institute of Technology, Israel, B. Suter, US Air Force Research Laboratory, USA, V. Tarokh, Harvard University, USA, S. Verdu, Princeton University, USA, M. Vetterli, Ecole Polytechnique Fédérale de Lausanne, Switzerland.