INTERCON 2011 - INTERCON 2011
Topics/Call fo Papers
The National University of Engineering (UNI) through its IEEE
Student Branch has the honor of hosting the biggest event of the IEEE
Section Peru, INTERCON. It is organized by students of this prestigious
university and under the guidance of national and international
professionals.
The Technical Committee invites you to the "XVIII International Congress
of Electrical, Electronic, Systems Engineering" - INTERCON 2011,and has
the honor of presenting the Call For Papers.
The Call For Papers INTERCON 2011 is a great scientific and technology
event. In which students and researchers from Latin America and the world
wide are invited to participate with their innovative researchs related
to (though not restricted to them):
*Electronics
*Microelectronics
*Power
*Computer Systems
*Industrial Applications
*Telecommunications
*Robotics & Automation
*Bioengineering
*Digital Signal Processing
*Education and Technology
*Applications in Electronics.
Important Dates:
* FULL PAPER SUBMISSION TO: 15/03/2011
* NOTIFICATION ACCEPTANCE:04/22/2011
* Responding as notice of attending DEADLINE: 07/23/2011
Presentation format:
The paper presented to INTERCON 2011 should be sent to the following
Email:
callforpapers-AT-intercon2011.org
Papers must be submitted in English or Spanish, it should follow the IEEE
format which is published in the website. The maximum number of pates is
8. The papers that will be accepted will be published with ISBN.
Organizer:
IEEE Student Branch of the National Engineering University
www.reieee.uni.edu.pe
Supported:
* National Engineering University in Lima, Peru www.uni.edu.pe * IEEE
Peru section www.ieeeperu.org
For more information about the INTERCON 2011 congress visit our website:
http://www.intercon2011.org
Student Branch has the honor of hosting the biggest event of the IEEE
Section Peru, INTERCON. It is organized by students of this prestigious
university and under the guidance of national and international
professionals.
The Technical Committee invites you to the "XVIII International Congress
of Electrical, Electronic, Systems Engineering" - INTERCON 2011,and has
the honor of presenting the Call For Papers.
The Call For Papers INTERCON 2011 is a great scientific and technology
event. In which students and researchers from Latin America and the world
wide are invited to participate with their innovative researchs related
to (though not restricted to them):
*Electronics
*Microelectronics
*Power
*Computer Systems
*Industrial Applications
*Telecommunications
*Robotics & Automation
*Bioengineering
*Digital Signal Processing
*Education and Technology
*Applications in Electronics.
Important Dates:
* FULL PAPER SUBMISSION TO: 15/03/2011
* NOTIFICATION ACCEPTANCE:04/22/2011
* Responding as notice of attending DEADLINE: 07/23/2011
Presentation format:
The paper presented to INTERCON 2011 should be sent to the following
Email:
callforpapers-AT-intercon2011.org
Papers must be submitted in English or Spanish, it should follow the IEEE
format which is published in the website. The maximum number of pates is
8. The papers that will be accepted will be published with ISBN.
Organizer:
IEEE Student Branch of the National Engineering University
www.reieee.uni.edu.pe
Supported:
* National Engineering University in Lima, Peru www.uni.edu.pe * IEEE
Peru section www.ieeeperu.org
For more information about the INTERCON 2011 congress visit our website:
http://www.intercon2011.org
Other CFPs
- WISIS 2012 : Second Workshop on Information Systems for Interactive Spaces (WISIS 2012)
- The International Conference on Image Analysis and Processing ICIAP
- ICIAP 2011 Special Session on Low-Level Color Image Processing
- SITA 2011 : The Third International Conference on Smart IT Applications
- GrC 2011 : IEEE International Conference on Granular Computing
Last modified: 2011-01-28 17:56:23