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(ETSM-APRIL- ) 2019 - International Conference on Engineering Technology, Smart Materials, Computing, Biotechnology, ICT & Applied Sciences (ETSM-APRIL-2019)
Date2019-04-03 - 2019-04-04
Deadline2019-03-15
VenueThe Aqueen Hotel Paya Lebar 33 Jalan Afifi, Singapore 409180, Singapore 
KeywordsThermal engineering; Technology; Engineering
Topics/Call fo Papers
We invite the scholars /scientists / engineers/ researchers / practitioners / students to join with us and share the new innovative trends in their respective field
Track 1- Computer and Software Engineering
Track 2- Mechanical & Metallurgical Engineering
Track 3- Electrical & Electronics Engineering
Track 4- Civil Engineering
Track 5- Bio-Technology & Food Technology
Track 6- Chemistry & Chemical Engineering
Track 7- Physical, Applied and Life Sciences
Track 8- Interdisciplinary
Track 1- Computer and Software Engineering
Track 2- Mechanical & Metallurgical Engineering
Track 3- Electrical & Electronics Engineering
Track 4- Civil Engineering
Track 5- Bio-Technology & Food Technology
Track 6- Chemistry & Chemical Engineering
Track 7- Physical, Applied and Life Sciences
Track 8- Interdisciplinary
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Last modified: 2018-07-25 19:53:40