IIRW 2012 - 2012 IEEE International Integrated Reliability Workshop (IIRW)
Date2012-10-14
Deadline2012-07-20
VenueSouth Lake, USA - United States
Keywords
Websitehttps://www.iirw.org
- 2nd International Symposium on Integrated Circuit Design and Integrated Systems
- 10th International Conference on Integrated Circuits and Microsystems (ICICM 2025)
- 9th International Conference on Reliability Engineering (ICRE 2025)
- 9th International Conference on System Reliability and Safety (ICSRS 2025)
- 7th International Conference on System Reliability and Safety Engineering (SRSE 2025)
Topics/Call fo Papers
The IEEE International Integrated Reliability Workshop (IRW) originated from the Wafer Level Reliability Workshop in 1982. The IRW focuses on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems. Through tutorials, paper presentations, discussion groups, special interest groups, and the informal format of the technical program, a unique environment is provided for understanding, developing, and sharing reliability technology and test methodology for present and future semiconductor applications as well as ample opportunity for discussions and interactions with colleagues.
Hot reliability topics for the workshop include: SiGe and strained Si, III-V, SOI, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, organic electronics, emerging memory technologies and future "nano"-technologies, NEMS/MEMS, photovoltaics, transistor reliability including hot carriers and NBTI/PBTI, Cu interconnects and low-k dielectrics, product reliability and burn-in strategy, impact of transistor degradation on circuit reliability, reliability modeling and simulation, optoelectronics, single event upsets.
Hot reliability topics for the workshop include: SiGe and strained Si, III-V, SOI, high-k and nitrided SiO2 gate dielectrics, reliability assessment of novel devices, organic electronics, emerging memory technologies and future "nano"-technologies, NEMS/MEMS, photovoltaics, transistor reliability including hot carriers and NBTI/PBTI, Cu interconnects and low-k dielectrics, product reliability and burn-in strategy, impact of transistor degradation on circuit reliability, reliability modeling and simulation, optoelectronics, single event upsets.
Other CFPs
- 2011 Third Pacific-Asia Conference on Circuits, Communications and System (PACCS)
- 3rd Workshop on Multimedia Computing and Communications (MCC)
- 5th Workshop on Wireless Mesh and Ad Hoc Networks (WiMAN)
- 5th Workshop on Performance Modeling and Evaluation in Computer and Telecommunication Networks (PMECT)
- 3rd Workshop on Grid and P2P Systems and Applications (GridPeer)
Last modified: 2012-06-27 23:37:21