Therminic 2018 - Therminic 2018
Date2018-09-26 - 2018-09-28
Deadline2018-04-11
Venue, Sweden
KeywordsElectronics Engineering; Cooling Concepts; Thermo-Mechanical Reliability
Websitehttps://therminic2018.eu
Topics/Call fo Papers
THERMINIC is the major European Workshop for thermal issues in electronic components and systems. For academics and industrialists involved in both micro and power electronics this annual event promises to be a very special occasion with a high quality technical program and exciting social events. We invite delegates to consider submitting abstracts that are related to, but not limited to, the following topics:
• Thermal Phenomena, Simulation and Experiment
• Electronics Cooling Concepts
• Thermo-Mechanical Reliability
• Thermal Phenomena, Simulation and Experiment
• Electronics Cooling Concepts
• Thermo-Mechanical Reliability
Other CFPs
Last modified: 2018-03-28 18:56:38