CI 2018 - Going Green – CARE INNOVATION 2018

The International CARE Electronics Office is pleased to announce the Going Green – CARE INNOVATION 2018 conference and exhibition on Electronics and the Environment. It will take place in Schoenbrunn Palace Conference Centre Vienna (Austria), which is situated in the Apothecaries’ Wing of the famous building. This Symposium is the only platform for presenting the up-to-date progress on sustainable development and the development of eco-efficient electr(on)ic & automotive products.
The program will feature the latest in circular economy, environmental design, clean manufacturing, resource efficiency, climate change, new eco-efficient technologies, collection, reverse logistics, refurbishment, carbon trading, re-use, recycling and policy making from leading experts in industry, academia, consulting, recyclers and public area around the globe. Leading companies and institutions in green electr(on)ics will present their innovative products, processes and services at the exhibition.
All companies in the electr(on)ics, telecom, automotive, solar and PV, chemical and recycling industry, power suppliers, electricity generators and distributors, contract manufacturers, material and component suppliers, service and logistic companies, collective systems, academia, consulting and public authorities (local, regional, international) are invited to attend and contribute.
International Program Committee
Rudolf Auer, Apple
Conny Bakker, TU Delft
Miquel Ballester, Fairphone
Subrata Barman, IFC International Finance Corporation
Nancy Gillis, Green Electronics Council
Todd Brady, Intel
Gianluca Brotto, Electrolux
Ignacio Calleja, EIT RawMaterials
Martin Charter, Centre for Sustainable Design
Jahau Lewis Chen, National Cheng Kung University
Jean Cox-Kearns, OTE Consulting
Gregor Eckerth, agiplan
Bibiana Ferrari, Relight/TREE
Thomas Fischer, Landbell
Colin Fitzpatrick, University of Limerick
Georg Fröhlich, Electrocycling
Maxime Furkel, Lexmark
Toni Gil, HP
Christian Hagelüken, Umicore
Carol Handwerker, Purdue University
Hidetaka Hayashi, EcoDeNet
Constantin Herrmann, thinkstep
Arpad Horvath, Berkeley University of California
Kensaku Ishibashi, Panasonic
Zsolt István, BayLogi
Hideki Kobayashi, Osaka University
Yoshinori Kobayashi, Toshiba
Bernd Kopacek, CARE Electronics
Joan Krajewski, Microsoft
Rüdiger Kühr, United Nations University
Edorta Larrauri, Gaiker
Kun Mo Lee, Ajou University
Pascal Leroy, WEEE Forum
Mitsutaka Matsumoto, AIST
Tom Moriarty, Dell
Katrin Müller, Siemens
Osamu Namikawa, Hitachi
Nils F. Nissen, Fraunhofer IZM
Guillermo O´Shea, Indumetal
Thomas Okrasinski, Alcatel-Lucent
Bob Pfahl, iNEMI
Magnus Piotrowski, Lenovo
Stefan Salhofer, Univ. of Natural Resources and Life Sciences (BOKU)
David Scuderi, amazon
Chris Slijkhuis, Müller-Guttenbrunn
Eelco Smit, Philips
Elisabeth Smith, step initiative
Pia Tanskanen, Nokia
Aidan Turnbull, BOMcheck
Jan Visser, SIMS
Norbert Zonneveld, EERA