VLSI-SoC 2011 - 2011 IEEE/IFIP 19th International Conference on VLSI and System-on-Chip (VLSI-SoC)
Topics/Call fo Papers
19th IEEE/IFIP International Conference on Very Large Scale
Integration, VLSI-SoC 2011
http://www.vlsi-soc.com/
VLSI-SoC is the 19th in a series of international conferences
sponsored by IFIP TC 10 Working Group 10.5, IEEE CEDA and CASS that
explores the state-of-the-art and the new developments in the field of
Very Large Scale Integration (VLSI), System-on-Chip (SoC) and their
designs. Previous Conferences have taken place in Edinburgh,
Trondheim, Tokyo, Vancouver, Munich, Grenoble, Gramado, Lisbon,
Montpellier, Darmstadt, Perth, Nice, Atlanta, Rhodes, Florianopolis
and Madrid. The purpose of VLSI-SoC is to provide a forum to exchange
ideas, and show industrial and research results in the fields of VLSI/
ULSI Systems, SoC design, VLSI CAD and Microelectronic Design and
Test. This edition special emphasis is given to the research area of
SoC Design for ubiquitous sensing and computing.
Topics of interest include but are not limited to:
T1. Analog and mixed-signal IC design
T2. Circuits and systems for Micro-sensing Applications
T3. 3-D integration, Physical Design, Compact Modeling, and
Electromagnetic Analysis
T4. Design for Variability, Reliability, Fault Tolerance, Test
T5. Digital Signal and Image Processing IC Design
T6. New Devices, MEMS and Microsystems
T7. Prototyping, Validation, Verification, Modelling and Simulation
T8. System-on-chip Design, Digital Architectures
T9. Embedded Systems Design, Real-time Systems
T10. Reconfigurable Systems, Compilers
T11. Logic and High-Level Synthesis
T12. Low-Power and Thermal-aware Design
Submission deadline: April 14th, 2011 *** New ***
Special session proposals deadline: April 14th , 2011 *** New ***
Acceptance notification: June 17th, 2011
Camera-ready paper due: July 11th, 2011
Paper Submission: Papers should present original research results not
published or submitted for publication in other forums. Papers should
not exceed 6 pages (single-spaced, 2 columns, 10pt font). Electronic
submission in PDF format to the http://www.vlsi-soc.com website is
required. The proceedings will be published by IEEE and available
through IEEE Xplore. They will be distributed during the conference to
all participants. A selection of the conference best papers will be
invited to submit an extended version to be included as chapters of a
book to be published by Springer. Author and contact information
(name, street/mailing address, telephone fax, e-mail) must be entered
during the submission process.
Paper Format: Submissions should be in 6-page camera-ready two-column
format, following the IEEE proceedings specifications located at:
http://www.ieee.org/web/publications/pubservices/c...
Paper Publication and Presenter Registration: Papers will be accepted
for regular or poster presentation at the conference. Every accepted
paper MUST have at least one author registered to the conference by
the time the camera-ready paper is submitted; the author is also
expected to attend the conference and present the paper.
Organizing Committee:
General Chair: Chi-Ying Tsui, HKUST, Hong Kong
Program Chair: Salvador Mir, TIMA Labs, France
Special Sessions Chair: Jiang Xu, HKUST, Hong Kong
Local Arrangement Chairs: Wing-Hung Ki, HKUST, Hong Kong,
Jiang Xu, HKUST, Hong Kong
Publication Chair: Oliver C.S. Choy, CUHK, Hong Kong
Ricardo Reis ? UFRGS, Brazil
Publicity Chair: Amine Bermak, HKUST, Hong Kong
Registration Chairs: Ngai Wong, HKU, Hong Kong, Hayden So, HKU, Hong
Kong
Finance Chair: George Yuan, HKUST, Hong Kong
PhD Forum Chair: Philip Mok, HKUST, Hong Kong,
Vijay Raghunathan, Purdue Univ.,
U.S.A.
Web Chair: Alex Leung, CUHK, Hong Kong
Regional liaison Co-Chairs: Weifeng He, Shanghai Jiao Tung Univ., China
Shou Shun Chen,
NTU, SIngapore
Huazhong Yang,
Tsinghua Univ.,
China
Steering Committee:
Manfred Glesner (TU Darmstadt, Germany)
Salvador Mir (TIMA, France)
Ricardo Reis (UFRGS, Brazil)
Michel Robert (U. of Montpellier, France)
Luis Miguel Silveira (INESC ID, Portugal
Best regards,
Chi-ying Tsui,
Hong Kong University of Science and Technology, Hong Kong
CONFERENCE CHAIR, VLSI-SoC 2011
Integration, VLSI-SoC 2011
http://www.vlsi-soc.com/
VLSI-SoC is the 19th in a series of international conferences
sponsored by IFIP TC 10 Working Group 10.5, IEEE CEDA and CASS that
explores the state-of-the-art and the new developments in the field of
Very Large Scale Integration (VLSI), System-on-Chip (SoC) and their
designs. Previous Conferences have taken place in Edinburgh,
Trondheim, Tokyo, Vancouver, Munich, Grenoble, Gramado, Lisbon,
Montpellier, Darmstadt, Perth, Nice, Atlanta, Rhodes, Florianopolis
and Madrid. The purpose of VLSI-SoC is to provide a forum to exchange
ideas, and show industrial and research results in the fields of VLSI/
ULSI Systems, SoC design, VLSI CAD and Microelectronic Design and
Test. This edition special emphasis is given to the research area of
SoC Design for ubiquitous sensing and computing.
Topics of interest include but are not limited to:
T1. Analog and mixed-signal IC design
T2. Circuits and systems for Micro-sensing Applications
T3. 3-D integration, Physical Design, Compact Modeling, and
Electromagnetic Analysis
T4. Design for Variability, Reliability, Fault Tolerance, Test
T5. Digital Signal and Image Processing IC Design
T6. New Devices, MEMS and Microsystems
T7. Prototyping, Validation, Verification, Modelling and Simulation
T8. System-on-chip Design, Digital Architectures
T9. Embedded Systems Design, Real-time Systems
T10. Reconfigurable Systems, Compilers
T11. Logic and High-Level Synthesis
T12. Low-Power and Thermal-aware Design
Submission deadline: April 14th, 2011 *** New ***
Special session proposals deadline: April 14th , 2011 *** New ***
Acceptance notification: June 17th, 2011
Camera-ready paper due: July 11th, 2011
Paper Submission: Papers should present original research results not
published or submitted for publication in other forums. Papers should
not exceed 6 pages (single-spaced, 2 columns, 10pt font). Electronic
submission in PDF format to the http://www.vlsi-soc.com website is
required. The proceedings will be published by IEEE and available
through IEEE Xplore. They will be distributed during the conference to
all participants. A selection of the conference best papers will be
invited to submit an extended version to be included as chapters of a
book to be published by Springer. Author and contact information
(name, street/mailing address, telephone fax, e-mail) must be entered
during the submission process.
Paper Format: Submissions should be in 6-page camera-ready two-column
format, following the IEEE proceedings specifications located at:
http://www.ieee.org/web/publications/pubservices/c...
Paper Publication and Presenter Registration: Papers will be accepted
for regular or poster presentation at the conference. Every accepted
paper MUST have at least one author registered to the conference by
the time the camera-ready paper is submitted; the author is also
expected to attend the conference and present the paper.
Organizing Committee:
General Chair: Chi-Ying Tsui, HKUST, Hong Kong
Program Chair: Salvador Mir, TIMA Labs, France
Special Sessions Chair: Jiang Xu, HKUST, Hong Kong
Local Arrangement Chairs: Wing-Hung Ki, HKUST, Hong Kong,
Jiang Xu, HKUST, Hong Kong
Publication Chair: Oliver C.S. Choy, CUHK, Hong Kong
Ricardo Reis ? UFRGS, Brazil
Publicity Chair: Amine Bermak, HKUST, Hong Kong
Registration Chairs: Ngai Wong, HKU, Hong Kong, Hayden So, HKU, Hong
Kong
Finance Chair: George Yuan, HKUST, Hong Kong
PhD Forum Chair: Philip Mok, HKUST, Hong Kong,
Vijay Raghunathan, Purdue Univ.,
U.S.A.
Web Chair: Alex Leung, CUHK, Hong Kong
Regional liaison Co-Chairs: Weifeng He, Shanghai Jiao Tung Univ., China
Shou Shun Chen,
NTU, SIngapore
Huazhong Yang,
Tsinghua Univ.,
China
Steering Committee:
Manfred Glesner (TU Darmstadt, Germany)
Salvador Mir (TIMA, France)
Ricardo Reis (UFRGS, Brazil)
Michel Robert (U. of Montpellier, France)
Luis Miguel Silveira (INESC ID, Portugal
Best regards,
Chi-ying Tsui,
Hong Kong University of Science and Technology, Hong Kong
CONFERENCE CHAIR, VLSI-SoC 2011
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Last modified: 2011-07-27 14:50:32