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SmartGridComm 2012 - 2012 IEEE Third International Conference on Smart Grid Communications (SmartGridComm)
Topics/Call fo Papers
Developing the Smart Grid has become an urgent global priority as its economic, environmental, and societal benefit will be enjoyed by generations to come. Information and communications technologies are at the core of the Smart Grid vision as they will empower today’s power grid with the capability of supporting two-way energy and information flow, isolating and restoring power outages more quickly, facilitating the integration of renewable energy sources into the grid and empowering the consumer with tools for optimizing their energy consumption.
The IEEE International Conference on Smart Grid Communications (SmartGridComm) is centered on all communications aspects that are relevant to the Smart Grid and aims at bringing together researchers from Academia, Industry, and National Labs to exchange novel ideas, explore enabling technologies, analyze theoretical issues, discuss innovative designs, address open problems, and share field trial experiences and lessons learnt.
The IEEE SmartGridComm Conference will be constituted of twelve Symposia. Each symposium will address a particular aspect of Smart Grid Communications. Prospective authors are invited to submit original contributions (standard two-column IEEE format and up to 6 pages) on all aspects of Smart Grid Communications to one of the following Symposia:
Cyber and Physical Security and Privacy
Interconnections and Communications of Electric Vehicles and Smart Grids
Virtual Power Plants, Distributed Generation, Microgrids, Renewables and Storage
Smart Grid and Area Networks (HAN, IAN, BAN, FAN and NAN)
Networking for Smart Grid (IETF, 6LoWPAN, ROLL, IPv4/IPv6, etc.)
Wide-Area Monitoring and Control
Architectures and Models for the Smart Grid
Smart/Virtual Metering, Demand Response, Dynamic Pricing
Standardization, Interoperability and Coexistence
The whole picture: Sense, Communicate, Compute, Control
Field trials, Deployments, and Lessons Learnt
Regulatory Issues and Their Impact on Communications Aspects
COMMITTEES
ORGANIZING COMMITTEE
General Co-Chairs
George Arnold, NIST, US
Stefano Galli, Panasonic, US
TPC Co-Chairs
Fred Baker, Cisco, US
Hamid Gharavi, NIST, US
Simon Haykin, McMaster University, Canada
Conference Manager
Gayle Weisman, IEEE ComSoc, US
Finance Chair
Bruce Worthman, IEEE ComSoc, US
Marketing
Heather Ann Sweeney, IEEE ComSoc, US
Graphic Design
Max Loskutnikov, IEEE ComSoc, US
Publication and Web Chair
Haobo Wang, Broadcom, US
Publicity Chair
Alex Gelman, NETovations Group, US
Society Relations Chair
Merrily Hartmann, AT&T (Retired), US
Student Travel Grant Chair
Shri Goyal, College of Technology & Management, US
SYMPOSIUM CHAIRS
Cyber/Physical Security and Privacy
William T. Polk, NIST/IETF, US
Russ Housley, Vigil Security, US
Dave McGrew, Cisco, US
Interconnections and Communications of Electric Vehicles and Smart Grids
Richard Scholer, Ford, US
Onur Altintas, Toyota, Japan
Le Yi Wang, Wayne State University, US
Virtual Power Plants, Distributed Generation, Microgrids, Renewable and Storage
Mischa Schwartz, Columbia University, US
Reza Iravani, Manitoba University, Canada
Frede Blaabjerg, Aalborg University, Denmark
Mohammad Shahidehpour, Illinois Institute of Technology, US
Smart Grid and Area Networks (HAN, IAN, BAN, FAN and NAN)
Himanshu Khurana, University of Illinois, Urbana-Champaign, US
Idris A Rai, Makerere University, Uganda
Nada Golmie, NIST, US
Networking for Smart Grid
Jean-Philippe Vasseur, Cisco, France
David E. Culler, University of California, Berkeley, US
Anjan Bose, Washington State University, US
Wide-Area Monitoring and Control
Mladen Kezunovic, Texas A&M University, US
Jim S Thorp, Virginia Tech, US
Gerald Fitzpatrick, NIST, US
Architectures and Models for the Smart Grid
Peter W. Sauer, University of Illinois, Urbana-Champaign, US
Anna Scaglione, University of California, Davis, US
Felix F. Wu, Honk Kong University, China
Smart/Virtual Metering, Demand Response, Dynamic Pricing
Tina Tsou, Huawei Technologies, China
Yoshizumi Serizawa, Central Research Institute of Electric Power Industry, Japan
Archan Misra, Telcordia Technologies, US
Standardization, Interoperability and Coexistence
David Su, NIST, US
Wayne Longcore, Consumers Energy, US
Lutz Lampe, University of British Columbia, Canada
Dick De Blasio, National Renewable Energy Laboratory, US
The Whole Picture: Sense, Communicate, Compute, Control
Mark McGranaghan, EPRI, US
Giuseppe Caire, University of Southern California, US
Pravin Varaiya, University of California, Berkeley, US
Nick Jenkins, Cardiff University, UK
Mardavij Roozbehani, MIT, US
Field Trials, Deployments, Lessons Learned
Gary Stuebing, Duke Energy, US
Charlie Arteaga, IBM, US
Skip Ashton, Ember Corporation, US
Ralf Lehnert, Technical University of Dresden, Germany
Ronnie Belmans, KU Louvain, Belgium
Regulatory Issues and Their Impact on Communications Aspects
Yi Qian, University of Nebraska, US
John Boot, GE Energy, US
Jeffrey Z. Tao, Mitsubishi Labs, US
TECHNICAL PROGRAM COMMITTEE
Jose Abad, Gigle Networks, Spain
Kaywan Afkhamie, Atheros, US
Bora Akyol, Pacific Northwest National Laboratory, US
Mohammod Ali, USC, US
Luis Almeida, Univerdida de do Porto, Portugal
Massoud Amin, University of Minnesota, US
Jeffrey Andrews, University of Texas, Austin, US
Farooq Anjum, On-Ramp Wireless, US
Hiroshi Asano, CRIEPI, Japan
Sami Ayyorgun, Telcordia Technologies, US
Agustin Badenes, DS2, Spain
David Bakken, Washington State University, US
Tom Basso, NREL, US
Inigo,Berganza, Iberdrola SA, Spain
Rakesh Bobba, University of Illinois, Urbana-Champaign, US
Michael Bourton, Grid2Home, US
Raouf Boutaba, University of Waterloo, Canada
Scott Bradner, Harvard University, US
John Buford, Avaya Labs Research, US
Gerd Bumiller, iAd GmbH, Germany
Eric Burger, Georgetown University, US
Francisco Cañete, Universidad de Malaga, Spain
Constantine Caramanis, University of Texas, Austin, US
Michael Caramanis, Boston University, US
Dave Cavalcanti, Philips Research, US
Liuchen Chang, University of New Brunswick, Canada
David Chassin, Pacific Northwest National Laboratory, US
Michael Chertkov, Los Alamos National Laboratory, US
Marco Chiani, University of Bologna, Italy
Howard Choe, Raytheon, US
Kaushik Chowdhury, Northeastern University, US
Peter Corcoran, National University of Ireland, Galway, Ireland
Robert Cragie, Gridmerge, UK
Subir Das, Telcordia Technologies, US
Chris Dent, Durham University, UK
Michael Devetsikiotis, North Carolina State University, US
Ian Dobson, University of Wisconsin-Madison, US
Mischa Dohler, CTTC, Spain
Klaus Dostert, University of Karlsruhe, Germany
Venizelos Efthymiou, Electricity Authority of Cyprus, Cyprus
Janaka Ekanayake, Cardiff University, UK
Nicola Elia, Iowa State University, US
Mostafa El-Said, Grand Valley State University, US
Tomaso Erseghe, University of Padova, Italy
Mehdi Ferdowsi, Missouri University of Science and Technology, US
Cecilia Galarza, University of Buenos Aires, Argentina
Brian Gaucher, IBM, US
Georgios B. Giannakis, University of Minnesota, US
Angelantonio Gnazzo, Telecom Italia, Italy
Manimaran Govindarasu, Iowa State University, US
Fabrizio Granelli, University of Trento, Italy
Gordon Gregg, Aclara, US
Edmund Handschin, University of Technology, Dortmund, Germany
Gareth Harrison, University of Edinburgh, UK
Pavithra Harsha, MIT, US
Mikio Hasegawa, Tokyo University of Science, Japan
Toru Hattori, CRIEPI, Japan
Carl Hauser, Washington State University, US
Haibo He, University of Rhode Island, US
Robert Heath, University of Texas, Austin, US
David, Holmberg, NIST, US
Choong Seon Hong, Kyung Hee University, Korea
James Hong, POSTECH, Korea
Halid Hrasnica, Eurescom, Germany
Marija Ilic, Carnegie Mellon University, US
Salvador Iranzo, DS2, Spain
Nihar Jindal, University of Minnesota, US
Jayant Kalagnanam, IBM Research, US
Masaaki Katayama, Nagoya University, Japan
Kiseon Kim, GIST - Gwangju, Korea
Joon Bae Kim, Lantiq, US
Tero Kivinen, AuthenTec, Finland
Stanley Klein, IEEE-USA, US
Mark Klerer, Qualcomm, US
Young-Chai Ko, Korea University, Korea
Rajeev Koodli, Cisco Systems, US
Tetsu Koyama, Xingtera Inc., Japan
Jim LeClare, Maxim Integrated Products, US
Jae-Jo, Lee, Korea Electrotechnology Research Institute, Korea
Claudio Lima, Sonoma Innovation, US
Eugene Litvinov, ISO New England, US
Angel Lozano, Universitat Pompeu Fabra, Spain
Fulcieri Maltini, FM Consultants Associates, France
Jay Manotas, Panasonic Automotive Systems, US
Moacyr Martucci, Escola Politécnica da Universidade de São Paulo, Brazil
George Michailidis, University of Michigan, US
Bill Miller, Mac-CT USA, US
Jim Mollenkopf, CURRENT Group, US
Raquel Morera, Telcordia Technologies, Inc., US
Stefan Mozar, University of Western Sydney, Australia
Peter Mueller, IBM Zurich Research Laboratory, Switzerland
Romano Napolitano, ISPLC and Regulatory Issues, Italy
Bruce Nordman, Lawrence Berkeley National Laboratory, US
Fabienne Nouvel, INSA, France
Dragan Obradovic, Siemens, Germany
Masato Oguchi, Ochanomizu University, Japan
Vladimir Oksman, Lantiq Inc., US
Barry O'Mahony, Intel Corporation, US
Jacob Østergaard, Technical University of Denmark, Denmark
Tetsuo Otani, Central Research Institute of Electric Power Industry, Japan
Tenti Paolo, University of Padova, Italy
Ioannis Papapanagiotou, North Carolina State University, US
Ghery Pettit, Intel Corporation, US
Ana Poida, Institute for Studies and Power Engineering, Romania
Kameshwar Poolla, University of California, Berkeley, US
Robert Qiu, Tennessee Tech University, US
Juergen Quittek, NEC Europe Ltd, Germany
Kaveh Razazian, Maxim Integrated Products, US
Jim Reilly, Reilly Associates, US
Moises Ribeiro, Federal University of Juiz de Fora, Brazil
David Rieken, Aclara Power-Line Systems Inc., US
Vincent Roca, INRIA Rhone-Alpes, France
Craig Rodine, Electric Power Research Institute, US
Sumit Roy, University of Washington, US
Zafer Sahinoglu, Mitsubishi Electric Research Laboratories, US
Hiroshi Shigeno, Keio University, Japan
Mik, St. Johns, Nth Permutation Security, US
Grzegorz Swirszcz, IBM T.J. Watson Research, US
Zhibin Tan, Wayne State University, US
Sekhar Tatikonda, Yale University, US
Don Tench, IESO, Canada
Daniel Thanos, General Electric, US
Kevin Tomsovic, University of Tennessee, US
Andrea Tonello, University of Udine, Italy
Lang Tong, Cornell University, US
Albert Treytl, Austrian Academy of Sciences, Austria
Daniela Tuninetti, University of Illinois, Chicago, US
Serdar Uckun, PARC, US
Han Vinck, University of Duisburg-Essen, Germany
Jeffrey Voas, NIST, US
Jianfeng Wang, Philips Research, US
Vincent Wong, University of British Columbia, Canada
Andrew Wright, N-Dimension Solutions, US
Peili Xu, Huawei Technologies, China
Akihisa Yokoyama, Toyota InfoTechnology Center, Japan
Abraham Young, Huawei Technologies, China
Michele Zorzi, University of Padova, Italy
The IEEE International Conference on Smart Grid Communications (SmartGridComm) is centered on all communications aspects that are relevant to the Smart Grid and aims at bringing together researchers from Academia, Industry, and National Labs to exchange novel ideas, explore enabling technologies, analyze theoretical issues, discuss innovative designs, address open problems, and share field trial experiences and lessons learnt.
The IEEE SmartGridComm Conference will be constituted of twelve Symposia. Each symposium will address a particular aspect of Smart Grid Communications. Prospective authors are invited to submit original contributions (standard two-column IEEE format and up to 6 pages) on all aspects of Smart Grid Communications to one of the following Symposia:
Cyber and Physical Security and Privacy
Interconnections and Communications of Electric Vehicles and Smart Grids
Virtual Power Plants, Distributed Generation, Microgrids, Renewables and Storage
Smart Grid and Area Networks (HAN, IAN, BAN, FAN and NAN)
Networking for Smart Grid (IETF, 6LoWPAN, ROLL, IPv4/IPv6, etc.)
Wide-Area Monitoring and Control
Architectures and Models for the Smart Grid
Smart/Virtual Metering, Demand Response, Dynamic Pricing
Standardization, Interoperability and Coexistence
The whole picture: Sense, Communicate, Compute, Control
Field trials, Deployments, and Lessons Learnt
Regulatory Issues and Their Impact on Communications Aspects
COMMITTEES
ORGANIZING COMMITTEE
General Co-Chairs
George Arnold, NIST, US
Stefano Galli, Panasonic, US
TPC Co-Chairs
Fred Baker, Cisco, US
Hamid Gharavi, NIST, US
Simon Haykin, McMaster University, Canada
Conference Manager
Gayle Weisman, IEEE ComSoc, US
Finance Chair
Bruce Worthman, IEEE ComSoc, US
Marketing
Heather Ann Sweeney, IEEE ComSoc, US
Graphic Design
Max Loskutnikov, IEEE ComSoc, US
Publication and Web Chair
Haobo Wang, Broadcom, US
Publicity Chair
Alex Gelman, NETovations Group, US
Society Relations Chair
Merrily Hartmann, AT&T (Retired), US
Student Travel Grant Chair
Shri Goyal, College of Technology & Management, US
SYMPOSIUM CHAIRS
Cyber/Physical Security and Privacy
William T. Polk, NIST/IETF, US
Russ Housley, Vigil Security, US
Dave McGrew, Cisco, US
Interconnections and Communications of Electric Vehicles and Smart Grids
Richard Scholer, Ford, US
Onur Altintas, Toyota, Japan
Le Yi Wang, Wayne State University, US
Virtual Power Plants, Distributed Generation, Microgrids, Renewable and Storage
Mischa Schwartz, Columbia University, US
Reza Iravani, Manitoba University, Canada
Frede Blaabjerg, Aalborg University, Denmark
Mohammad Shahidehpour, Illinois Institute of Technology, US
Smart Grid and Area Networks (HAN, IAN, BAN, FAN and NAN)
Himanshu Khurana, University of Illinois, Urbana-Champaign, US
Idris A Rai, Makerere University, Uganda
Nada Golmie, NIST, US
Networking for Smart Grid
Jean-Philippe Vasseur, Cisco, France
David E. Culler, University of California, Berkeley, US
Anjan Bose, Washington State University, US
Wide-Area Monitoring and Control
Mladen Kezunovic, Texas A&M University, US
Jim S Thorp, Virginia Tech, US
Gerald Fitzpatrick, NIST, US
Architectures and Models for the Smart Grid
Peter W. Sauer, University of Illinois, Urbana-Champaign, US
Anna Scaglione, University of California, Davis, US
Felix F. Wu, Honk Kong University, China
Smart/Virtual Metering, Demand Response, Dynamic Pricing
Tina Tsou, Huawei Technologies, China
Yoshizumi Serizawa, Central Research Institute of Electric Power Industry, Japan
Archan Misra, Telcordia Technologies, US
Standardization, Interoperability and Coexistence
David Su, NIST, US
Wayne Longcore, Consumers Energy, US
Lutz Lampe, University of British Columbia, Canada
Dick De Blasio, National Renewable Energy Laboratory, US
The Whole Picture: Sense, Communicate, Compute, Control
Mark McGranaghan, EPRI, US
Giuseppe Caire, University of Southern California, US
Pravin Varaiya, University of California, Berkeley, US
Nick Jenkins, Cardiff University, UK
Mardavij Roozbehani, MIT, US
Field Trials, Deployments, Lessons Learned
Gary Stuebing, Duke Energy, US
Charlie Arteaga, IBM, US
Skip Ashton, Ember Corporation, US
Ralf Lehnert, Technical University of Dresden, Germany
Ronnie Belmans, KU Louvain, Belgium
Regulatory Issues and Their Impact on Communications Aspects
Yi Qian, University of Nebraska, US
John Boot, GE Energy, US
Jeffrey Z. Tao, Mitsubishi Labs, US
TECHNICAL PROGRAM COMMITTEE
Jose Abad, Gigle Networks, Spain
Kaywan Afkhamie, Atheros, US
Bora Akyol, Pacific Northwest National Laboratory, US
Mohammod Ali, USC, US
Luis Almeida, Univerdida de do Porto, Portugal
Massoud Amin, University of Minnesota, US
Jeffrey Andrews, University of Texas, Austin, US
Farooq Anjum, On-Ramp Wireless, US
Hiroshi Asano, CRIEPI, Japan
Sami Ayyorgun, Telcordia Technologies, US
Agustin Badenes, DS2, Spain
David Bakken, Washington State University, US
Tom Basso, NREL, US
Inigo,Berganza, Iberdrola SA, Spain
Rakesh Bobba, University of Illinois, Urbana-Champaign, US
Michael Bourton, Grid2Home, US
Raouf Boutaba, University of Waterloo, Canada
Scott Bradner, Harvard University, US
John Buford, Avaya Labs Research, US
Gerd Bumiller, iAd GmbH, Germany
Eric Burger, Georgetown University, US
Francisco Cañete, Universidad de Malaga, Spain
Constantine Caramanis, University of Texas, Austin, US
Michael Caramanis, Boston University, US
Dave Cavalcanti, Philips Research, US
Liuchen Chang, University of New Brunswick, Canada
David Chassin, Pacific Northwest National Laboratory, US
Michael Chertkov, Los Alamos National Laboratory, US
Marco Chiani, University of Bologna, Italy
Howard Choe, Raytheon, US
Kaushik Chowdhury, Northeastern University, US
Peter Corcoran, National University of Ireland, Galway, Ireland
Robert Cragie, Gridmerge, UK
Subir Das, Telcordia Technologies, US
Chris Dent, Durham University, UK
Michael Devetsikiotis, North Carolina State University, US
Ian Dobson, University of Wisconsin-Madison, US
Mischa Dohler, CTTC, Spain
Klaus Dostert, University of Karlsruhe, Germany
Venizelos Efthymiou, Electricity Authority of Cyprus, Cyprus
Janaka Ekanayake, Cardiff University, UK
Nicola Elia, Iowa State University, US
Mostafa El-Said, Grand Valley State University, US
Tomaso Erseghe, University of Padova, Italy
Mehdi Ferdowsi, Missouri University of Science and Technology, US
Cecilia Galarza, University of Buenos Aires, Argentina
Brian Gaucher, IBM, US
Georgios B. Giannakis, University of Minnesota, US
Angelantonio Gnazzo, Telecom Italia, Italy
Manimaran Govindarasu, Iowa State University, US
Fabrizio Granelli, University of Trento, Italy
Gordon Gregg, Aclara, US
Edmund Handschin, University of Technology, Dortmund, Germany
Gareth Harrison, University of Edinburgh, UK
Pavithra Harsha, MIT, US
Mikio Hasegawa, Tokyo University of Science, Japan
Toru Hattori, CRIEPI, Japan
Carl Hauser, Washington State University, US
Haibo He, University of Rhode Island, US
Robert Heath, University of Texas, Austin, US
David, Holmberg, NIST, US
Choong Seon Hong, Kyung Hee University, Korea
James Hong, POSTECH, Korea
Halid Hrasnica, Eurescom, Germany
Marija Ilic, Carnegie Mellon University, US
Salvador Iranzo, DS2, Spain
Nihar Jindal, University of Minnesota, US
Jayant Kalagnanam, IBM Research, US
Masaaki Katayama, Nagoya University, Japan
Kiseon Kim, GIST - Gwangju, Korea
Joon Bae Kim, Lantiq, US
Tero Kivinen, AuthenTec, Finland
Stanley Klein, IEEE-USA, US
Mark Klerer, Qualcomm, US
Young-Chai Ko, Korea University, Korea
Rajeev Koodli, Cisco Systems, US
Tetsu Koyama, Xingtera Inc., Japan
Jim LeClare, Maxim Integrated Products, US
Jae-Jo, Lee, Korea Electrotechnology Research Institute, Korea
Claudio Lima, Sonoma Innovation, US
Eugene Litvinov, ISO New England, US
Angel Lozano, Universitat Pompeu Fabra, Spain
Fulcieri Maltini, FM Consultants Associates, France
Jay Manotas, Panasonic Automotive Systems, US
Moacyr Martucci, Escola Politécnica da Universidade de São Paulo, Brazil
George Michailidis, University of Michigan, US
Bill Miller, Mac-CT USA, US
Jim Mollenkopf, CURRENT Group, US
Raquel Morera, Telcordia Technologies, Inc., US
Stefan Mozar, University of Western Sydney, Australia
Peter Mueller, IBM Zurich Research Laboratory, Switzerland
Romano Napolitano, ISPLC and Regulatory Issues, Italy
Bruce Nordman, Lawrence Berkeley National Laboratory, US
Fabienne Nouvel, INSA, France
Dragan Obradovic, Siemens, Germany
Masato Oguchi, Ochanomizu University, Japan
Vladimir Oksman, Lantiq Inc., US
Barry O'Mahony, Intel Corporation, US
Jacob Østergaard, Technical University of Denmark, Denmark
Tetsuo Otani, Central Research Institute of Electric Power Industry, Japan
Tenti Paolo, University of Padova, Italy
Ioannis Papapanagiotou, North Carolina State University, US
Ghery Pettit, Intel Corporation, US
Ana Poida, Institute for Studies and Power Engineering, Romania
Kameshwar Poolla, University of California, Berkeley, US
Robert Qiu, Tennessee Tech University, US
Juergen Quittek, NEC Europe Ltd, Germany
Kaveh Razazian, Maxim Integrated Products, US
Jim Reilly, Reilly Associates, US
Moises Ribeiro, Federal University of Juiz de Fora, Brazil
David Rieken, Aclara Power-Line Systems Inc., US
Vincent Roca, INRIA Rhone-Alpes, France
Craig Rodine, Electric Power Research Institute, US
Sumit Roy, University of Washington, US
Zafer Sahinoglu, Mitsubishi Electric Research Laboratories, US
Hiroshi Shigeno, Keio University, Japan
Mik, St. Johns, Nth Permutation Security, US
Grzegorz Swirszcz, IBM T.J. Watson Research, US
Zhibin Tan, Wayne State University, US
Sekhar Tatikonda, Yale University, US
Don Tench, IESO, Canada
Daniel Thanos, General Electric, US
Kevin Tomsovic, University of Tennessee, US
Andrea Tonello, University of Udine, Italy
Lang Tong, Cornell University, US
Albert Treytl, Austrian Academy of Sciences, Austria
Daniela Tuninetti, University of Illinois, Chicago, US
Serdar Uckun, PARC, US
Han Vinck, University of Duisburg-Essen, Germany
Jeffrey Voas, NIST, US
Jianfeng Wang, Philips Research, US
Vincent Wong, University of British Columbia, Canada
Andrew Wright, N-Dimension Solutions, US
Peili Xu, Huawei Technologies, China
Akihisa Yokoyama, Toyota InfoTechnology Center, Japan
Abraham Young, Huawei Technologies, China
Michele Zorzi, University of Padova, Italy
Other CFPs
- 2011 IEEE 6th International Workshop on Intelligent Data Acquisition and Advanced Computing Systems: Technology and Applications (IDAACS)
- 2011 International Symposium on System Modeling, Simulation and Engineering Mathematics (SMSEM)
- 2011 Faible Tension Faible Consommation (FTFC)
- 2010 IEEE 4th International Conference on Nano/Molecular Medicine and Engineering (NANOMED)
- 2011 16th International Conference on Intelligent System Applications to Power Systems (ISAP)
Last modified: 2011-11-14 09:38:49