ICMMP 2011 - 2011 International Conference on Mechatronics and Materials Processing

2011 International Conference on Mechatronics and Materials Processing (ICMMP 2011)
November 18-20 2011, Guangzhou China

Call for Papers

2011 International Conference on Mechatronics and Materials Processing (ICMMP2011) will be held during November 18-20, 2011, in Guangzhou, China. ICMMP2011 aims to provide a high-level international forum for researchers, engineers and scientists to present the new advances and research results in the fields of Mechatronics and Materials Processing. All accepted papers will be published in international journal "Advanced Materials Research" [ISSN:1022-6680, Trans Tech Publications] and will be indexed in the major academic databases, including EI Compendex, Thomson ISI (ISTP), and other indexing services. About 100 selected excellent papers will be published in SCI-indexed journals Materials and Manufacturing Processes , Surface Engineering, Advanced Science Letters. Topics of interest include, but are not limited to:
(I) Material Science and Technology
(01) Nanomaterials
(02) Composites and polymer materials
(03) Biomaterials
(04) Semi-conductor and micro-electronic materials
(05) Smart/Intelligent Materials/Intelligent Systems
(06) Thin Films
(07) New Functional Materials
(08) Metal alloy materials
(09) Iron and Steel
(10) Building Materials
(11) Materials forming
(12) Coatings and surface engineering
(13) Materials Characterization
(14) Mechanical Behavior & Fracture
(15) Testing and Evaluation of Materials
(II) Manufacturing Technology and Processing
(16) Modeling, analysis and simulation of manufacturing processes
(17) High-speed/precision machining
(18) CAD/CAM/ CAE
(19) Virtual manufacturing and concurrent engineering
(20) Green design and manufacturing
(21) Digital and agile manufacturing
(22) PDM, ERP, logistics and supply chain
(23) Bionic mechanisms and bio-manufacturing
(24) Tribology in Manufacturing Processes
(25) Integrated Manufacturing System
(26) Laser Processing Technology
(27) Materials Machining
(28) Micro- and nano-fabrication, materials processing and technology
(29) Thermal Engineering Theory and Applications
(30) Testing, measuring, monitoring and controlling of manufacturing processes
(31) Engineering Optimization
(32) Product Design and Development
(33) Project/Engineering Management
(III) Mechatronics and Automation
(34) Mechatronics
(35) Industrial Robotics and Automation
(36) Intelligent control, neuro-control, fuzzy control
(37) Industrial Automation and Process Control
(38) Distributed Control System
(39) Embedded System
(40) Control system modeling and simulation techniques
(41)Enterprise Informationization and information processing technology
(42)Virtual Instrumentation
(43)Sensors, multi-sensor data fusion algorithms
(44)Advanced measurement and Machine Vision system
(45)Transmission and control of Fluid
(46)Dynamics, Vibration and Control
(IV) Engineering Education and Training
(47) Engineering education and training
(V) Other related topics
(48) Other related topics

Paper Submission

All papers must be written in English. Please prepare your paper in strict accordance with the format available at the conference website (http://www.icmmp.org). And submit your papers and the filed Paper Submission Form by email attachment to the ICMMP2011 Conference organizer (icmmpx-AT-gmail.com) by the given deadline. All papers should be no less than 4 pages in length and shorter papers should not be included in the journal. Document file in PDF and MS Word format are both required when submitting your papers.

Important Dates (Deadline):

Submission of full Papers May 25, 2011
Notification of Papers Acceptance: June 10, 2011
Camera Ready Submission and Registration July 1, 2011
Conference November 18-20, 2011

Registration

The registration fee is 400 U.S. Dollars or 2600 RMB for each paper (over 4 pages extra-charge 50 U.S. Dollars or 300 RMB per page needs to be paid). Only one paper can be included into the journal by paying one registration fee; you can pay Extra Paper Charges (2300 RMB or 350 U.S. Dollars) for one more paper from the same first author who already has a paid registration. Extra-charge for Papers, which will be published in SCI-indexed journals, needs to be paid.

Sponsors

The University of New South Wales, Australia
Zhejiang University, China
Xi’an Jiaotong University, China
The Hong Kong Polytechnic University, Hong Kong
Guangzhou University, China
Trans Tech Publications Inc.
Materials and Manufacturing Processes (Taylor & Francis)
Surface Engineering (Maney Publishing)
Advanced Science Letters (American Scientific Publishers)

Contact Information
E-mail: icmmpx-AT-gmail.com Website: http://www.icmmp.org Tel: +86 20 3936 6470
School of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou 510006, China