TEI 2019 - Thirteenth International Conference on Tangible, Embedded, and Embodied Interaction
Date2019-03-17 - 2019-03-21
VenueTempe, AZ, USA - United States
Topics/Call fo Papers
The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances.
Last modified: 2017-10-27 13:46:04