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TEI 2019 - Thirteenth International Conference on Tangible, Embedded, and Embodied Interaction

Date2019-03-17 - 2019-03-21


VenueTempe, AZ, USA - United States USA - United States



Topics/Call fo Papers

The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances.

Last modified: 2017-10-27 13:46:04