TEI 2019 - Thirteenth International Conference on Tangible, Embedded, and Embodied Interaction
Date2019-03-17 - 2019-03-21
Deadline2018-08-02
VenueTempe, AZ, USA - United States
Keywords
Websitehttps://tei.acm.org/2019
Topics/Call fo Papers
The ACM International Conference on Tangible, Embedded and Embodied Interaction (TEI) addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances.
Other CFPs
- Twelfth ACM International Conference on Web Search and Data Mining
- 24th Asia and South Pacific Design Automation Conference
- 2018 Interactive Surfaces and Spaces
- How to Rebuild American Manufacturing to Create Jobs and Prosperity
- 26th ACM SIGSOFT International Symposium on the Foundations of Software Engineering
Last modified: 2017-10-27 13:46:04