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ASICON 2011 - 2011 IEEE 9th International Conference on ASIC (ASICON 2011)

Date2011-10-25

Deadline2011-06-30

VenueXiamen, China China

Keywords

Websitehttps://www.asicon.org

Topics/Call fo Papers

The 9th International Conference on ASIC (ASICON 2011) will be held in Xiamen, China, during October 25-28, 2011. The conference is intended to provide an international forum for VLSI circuit designers, ASIC users, system integrators, IC manufacturers、process & device engineers and CAD/CAE tool developers to present their updated progresses, developments and research results in their respective fields. The three-day event features keynote speeches on state-of-the-art VLSI circuit、device、process design and manufacturing technologies, regular paper presentations, as well as tutorials delivered by leading experts in the respective fields. The Excellent Student Paper award will be announced at the conference. Additionally, an exhibition on EDA tools, foundry technologies, IC test facilities, and novel ASIC products will be held during the conference.

I.Design Techniques
1. VLSI Design and Circuits
l Low power techniques, high-speed circuits
l Embedded processors and DSP
l Chaos/neural/fuzzy-logic circuits
l Programmable devices (PLD, EPLD, HDPLD, FPGA, etc)
l NoC
2. Analog, Mixed Signal and RF Circuits
l Data converters (ADCs and DACs)
l RF circuits(narrowband RF, ultra low power and millimeter-wave circuits (MMDS, 60GHz), RF/IF and power amplifiers, frequency generators, RF switches, power detectors, active antennas )
l Power systems and power electronic circuits
3. Application-Specific SoCs
l Auto-mobile electronics and Industry Control
l Biomedical circuits and systems
l Sensory systems
l Graph theory and computing
l Neural systems and Applications
4. Circuits and Systems for Wireless Communications
l Receivers,transimitters technologies for wireless systems (WLAN, WPAN, WMAN, GPS, DVB/DMB,UWB, Blutooth, GSM/EDGE/CDMA/UMTS/3G/4G base stations and handsets, TV, radio, satellite)
l RFID
l ISM band systems
5. Testing, Reliability, Fault-Tolerance
l Digital/analog/mix-signal testing
l Design for testability and reliability
l Test vector compression and silicon debug and diagnosis
l Variation-aware design
l Static and dynamic defect and fault recoverability
6. Advanced Memory
l DRAM & SRAM ● Flash Memory
l Ferroelectric Memory
l Phase Change Memory & RRAM & MRAM
II. CAD Techniques
7. Circuits Simulation, Synthesis, Verification and Physical design
l Analog Circuits modeling and simulation
l Logic synthesis, simulation and formal verification
l Partitioning, placement and floor planning
l Routing and detailed physical design
8. CAD for system, Design for Manufacturing and Testing
l Embedded systems
l Mixed technology/domain, reliable and alternative systems
l Design for manufacturability and testing
III. Emerging Applications and New Technologies
9. MEMS Techniques
l Piezoelectric and MEMS application
l Pyroelectric/IR/optical application
l Chemical and Bio-Chips
10. Nanoelectronics and Gigascale systems
l Nano Devices and NEMS
11. New Devices,Hetro-integration, 3-D integration and so on
12. VLSL New Processing, New Technologies and their integration
13. VLSI application for Energy generation, conservation and control
IV. Other VLSI Device and Design related topics

Last modified: 2010-11-20 17:34:40