ICDEPI 2018 - 2018 2nd International Conference on Design Engineering and Product Innovation (ICDEPI 2018)

Call for paper
2018 2nd International Conference on Design Engineering and Product Innovation (ICDEPI 2018)
July. 1-3, 2018 ｜Dalian, China
http://www.icdepi.org/
2018 2nd International Conference on Design Engineering and Product Innovation (ICDEPI 2018) is co-organized by Dalian University of Technology, Nazarbayev University and Hong Kong Society of Mechanical Engineers (HKSME). The conference will be held at Dalian, China from July 1-3, 2018!
The conference is an international forum for the presentation of technological advances and research results in the fields of Design Engineering and Product Innovation.
●Publication and Indexing
1, All papers will be published in IOP Conference Series: Materials Science and Engineering(ISSN: 1757-899X), which will be indexed by SCOPUS, Ei Compendex and other academic databases.
2, High quality papers will be recommended to publish in International Journal for Simulation and Multidisciplinary Design Optimization (IJSMDO), ISSN 1779-6288( Online), indexed by SCOPUS, DOAJ, Google Scholar, ProQuest, Crossref, etc.
●2018 Keynote Speakers:
1.Prof.Huang Weimin, Nanyang Technological University, Singapore
2.Prof.Sam Zhang Shanyong, Southwest University, China
3.Prof.Shu Dong Wei, Nanyang Technological University, Singapore
4.Prof.Shunying Ji, Dalian university of Technology, China
5.Prof.Cees De Bont,Hong Kong Polytechnic University, Hong Kong
6.Prof.Henri Christiaans,Ulsan National Institute of Science & Technology, South Korea
●Topics of interest for submission include, but are not limited to:
Design Engineering
Design Processes
Design Theory and Research Methodology
Design Organization and Management
Product, Service and Systems Design
Design Information and Knowledge
Production Innovation
Product Development and Design
Product Process Design and Management
Product Quality Management
Intelligent Product
More topics can be found at: http://www.icdepi.org/cfp.html
●Paper Submission
1.You can choose to submit your paper directly to icdepi-AT-smehk.org
2.You can submit your full paper through electronic submission system: https://cmt3.research.microsoft.com/ICDEPI2018
●Call for participants
1,Presenter: If you are interested in presenting your research on the conference, without publishing your paper in the proceeding, please submit the abstract to us: icdepi-AT-smehk.org
2,Listener:If you are interested in attending the conference to participant this gathering on the field of Design Engineering and Product Innovation, you are welcome to join us and share your ideas.fill the form and send it to us: icdepi-AT-smehk.org
3,Reviewer:Experts in the area of Design Engineering and Product Innovation are welcome to join the conference as reviewer. HKSME will award certificate to each volunteer.Send your curriculum vitae(CV) to us: icdepi-AT-smehk.org
●Contact Us:
If you have any question, please feel free to contact our conference secretary.
Ms. Suzy Shih
Tel:+852-30697937
Welcome you to contact us by Email to icdepi-AT-smehk.org
http://www.icdepi.org/