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CAS 2012 - 2012 International Semiconductor Conference (CAS 2012)

Date2012-10-15

Deadline2012-06-15

VenueSinaia, Romania Romania

Keywords

Websitehttps://www.imt.ro/cas

Topics/Call fo Papers

The aim of the conference is two?fold. First of all, it provides a forum of debate on selected topics for scientific research and technological development. Secondly, it is an occasion for the participants to broad their perspective through invited papers and tutorials.

TOPICS: Contributions in solid-state devices and (sub)systems are called in the following domains.
- Simulation and fabrication of microstructures and microsystems:
surface and bulk micromachining, microengineering techniques, electro-opto-mechanical microsystems, microsensor and actuator integration, signal processing, computational intelligence and system interfacing, biosensors and microsystems for biomedical application; optical, opto-electronic and photonic functional components, RF MEMS;
- Science and technology of nanostructures and nanostructured materials:
composite nanoparticles and nanostructures with selective properties, nanostructures and nanostructured materials with special properties, nanotechnologies and nanostructure;
- Semiconductor device physics and technology:
device modelling and simulation, silicon and compound semiconductor devices, heterostructures, advanced materials and processes, reliability and defect engineering;
- Design and technology of microelectronic components:
microelectronic, microphotonic and microwave integrated subsystems, devices and modules for power control and conversion, specialized electronic circuits integrated in the microelectronic technology, testing and reliability;

HIGHLIGHTS:
- Nanoscience and nanoengineering
- Microoptics and microphotonics
- Micromachined devices and circuits for microwave and millimeter wave applications
- Micro and nanotechnologies for transducers, interfaces and microsystems
- Micro and nanotechnologies for biomedical and environmental applications
- Novel materials and intelligent materials
- Power devices and microelectronics (including CAD)

Last modified: 2011-11-27 22:20:35