TechDebt 2018 - First International Conference on Technical Debt

The First International Conference on Technical Debt will be held in Gothenburg, Sweden, on May 27-28, 2018 collocated with ICSE 2018.
Technical debt is a metaphor that software developers and managers increasingly use to communicate key tradeoffs related to release and quality issues. The Managing Technical Debt workshop series had, since 2010, brought together practitioners and researchers to discuss and define issues related to technical debt and how they can be studied. Workshop participants reiterated the usefulness of the concept each year, shared emerging practices used in software development organizations, and emphasized the need for more research and better means for sharing emerging practices and results.
As the interest from our industry and academic researchers in Technical Debt has steadily grown, the workshop series has morphed into a full conference in 2018. Our goal for this conference on Technical Debt is to bring together leading software engineering researchers and practitioners for the purpose of exploring theoretical and practical techniques for managing technical debt.
Topics of interest
The following topics are aligned with the conference theme:
Identification of technical debt
Visualization of technical debt
Analysis of technical debt
Metrics for technical debt
Economic models for describing or reasoning about technical debt
Understanding causes and effects of technical debt
Relationship of technical debt to software evolution, maintenance, and aging
Relationship of technical debt with other activities, such as testing or requirement elicitation
The business case for technical debt management
Technical debt and software life-cycle management
Technical debt within a software ecosystem
Technical debt in designs and architecture
Technical debt in software models
Techniques and tools for calculating technical debt principal and interest
Concrete practices and tools used to measure and control technical debt
Education related to technical debt
Submission information
We invite submissions of papers in any areas related to the theme and goal of the conference in the following three categories:
Research Papers: describing innovative and significant original research in the field (up to 10 pages max.)
Industrial Papers: describing industrial experience, case studies, challenges, problems, and solutions (up to 10 pages max)
Short papers: Position and Future Trend Papers: describing ongoing research, new results (up to 5 pages max.)
Submissions must be original and unpublished work. Each submitted paper will undergo a rigorous review process by three members of the program committee. Submissions must be submitted online via the TechDebtConf2018 EasyChair conference management system and conform to the ICSE formatting guidelines.
The official publication date is the date the proceedings are made available in the ACM Digital Library. This date may be up to two weeks prior to the first day of ICSE 2018. The official publication date affects the deadline for any patent filings related to published work. Purchases of additional pages in the proceedings is not allowed.
Accepted papers must be presented in person at the conference by one of the authors. Excellent papers will be considered for a Distinguished Paper Award from ACM Sigsoft.